Sanyo Electric Co., Ltd.

Sanyo Semiconductor Co., Ltd.

Sanyo Consumer Electronics Co., Ltd.

Koichiro Ono

Sadamichi Takakusaki

Akihisa Matsumoto

Provided are: a light emitting module which has an improved heat-dissipating property and whose reflectance reduction is prevented. The light emitting module mainly includes: a metal substrate; a conductive pattern formed on the upper surface of the metal substrate; and a light emitting element disposed on the upper surface of the metal substrate and electrically connected to the conductive pattern. Furthermore, in the light emitting module, an insulating layer is removed in a region where the conductive pattern is not formed, but is left unremoved in a region right below (or covered with) the conductive pattern. In other words, in the region where the conductive pattern is not formed, the upper surface of the metal substrate is not covered with the conductive pattern, and a metal material constituting the metal substrate is exposed.

Light emitting module and method for manufacturing the same

In a light-emitting diode array panel in which an array of light-emitting diode pellets having a light-emitting region are arranged substantially in a straight line on a long and narrow substrate made of resin along the length thereof and on one side of the width center thereof, the substrate is kept warped when the light-emitting diode pellets are arranged on the substrate. Alternatively, the light-emitting diode pellets are arranged in a curved line. This ensures that the array of light-emitting diode pellets forms a straight line after a heat-hardening process.

Growing community of inventors

Tottori, Japan

Koichiro Ono