Sekisui Kasei Co., Ltd.

Koichiro Okamoto

Ryo Akuta

The present invention relates to a hydrogel and use thereof. More specifically, the present invention relates to a hydrogel comprising water and a polymer matrix, wherein the polymer matrix comprises a copolymer of a monofunctional monomer having a hydrophilic group and one ethylenic unsaturated group, and a polyfunctional monomer having no ester bond, and having an amide group and 3 to 6 ethylenic unsaturated groups, 40 to 95 parts by mass of the water, and 5 to 60 parts by mass of the polymer matrix are contained in 100 parts by mass of the hydrogel, and the hydrogel shows a swelling degree of 650% or less, when the hydrogel is immersed in a 4M aqueous KOH solution under a temperature of 25° C. for 14 days, and use thereof.

Hydrogel and uses therefor

There are provided a laminate and the like and a circuit board including the same that exhibit an excellent low dielectric property by a non-conventional new approach. The laminate according to an embodiment of the present invention is a laminate used for a core layer of a circuit board, in which the laminate does not include a buildup layer, the laminate is obtained by laminating a plurality of prepregs including a fiber base material layer and a resin layer (A) so that the prepregs are in direct contact with each other, the resin layer (A) contains an inorganic filler and hollow resin particles, and the hollow resin particles are contained in the resin layer (A) in an amount of 1% by weight to 50% by weight with respect to the total amount of the resin layer (A).

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Osaka, Japan

Koichiro Okamoto