Nec Corporation

Nec Tokin Corporation

Koichiro Masuda

Hirokazu Tohya

Satoshi Arai

Masaharu Satoh

Yoshihiko Saiki

Hideki Shimizu

Tooru Mori

A capacitive element that can efficiently reduce high-frequency noise generated in a circuit is provided. A capacitive elementincludes a capacitive formation portion, which is formed in the shape of a loop to separate the inside from the outside. The capacitive formation portionincludes an electrode, an opposite electrode, and a dielectric layer. One or more outgoing terminals (one or more outer circumference outgoing terminals, and one or more internal circumference outgoing terminals) are provided at the outer and inner circumferences of the electrode, respectively. A printed wiring board is made by mounting the capacitive element inside the board or on the surface of the board. A semiconductor package is made by putting the capacitive elementon a target semiconductor circuit portion. Moreover, a semiconductor circuit is made by placing the capacitive element on a target functional circuit portion

Capacitance element, printed circuit board, semiconductor package, and semiconductor circuit

[Problem to be Solved] To provide a helical capacitor for controlling a high-frequency power which flows in power lines, and a manufacturing method of the helical capacitor. [Solution] A helical capacitor is constituted by helically spiraling a belt shape capacitor linewhich includes an internal metal body to be a helically spiraled belt-shape internal electrical conductor, a dielectric film covering the internal electrical conductor, and an electrically conductive layer covering the dielectric film. The capacitor line of belt shapecan be wrapped around the internal support body. Internal metal body lead terminalsare respectively formed at both ends of the internal metal body, and electrically conductive layer lead terminals,can be respectively formed at both ends of the electrically conductive layer.

Helical capacitor and manufacturing method thereof

Provided are a spacer capable of avoiding a poor connection due to the suction of solder when the clearance width between a soldered semiconductor device and a printed circuit board is made constant, and a manufacturing method for the spacer. The spacer includes an electrically insulating base member, and at least one solder guiding terminal. The base member has a bottom face, a top face and at least one side face, of which the bottom face and the top face are out of contact with each other whereas the side face contacts one or both the bottom face and the top face. The solder guiding terminal covers the bottom face partially, the top face partially, and the side face partially or wholly. A solder guiding face as the surface of a portion of the solder guiding terminal covering the side face is not normal to the bottom face.

Spacer, and its manufacturing method

Electromagnetic waves leaking from a power distribution circuit provided on a printed wiring substrate or in a semiconductor package are suppressed, and degradation of the waveform of a signal generated by a high-speed digital circuit. A strip line device comprises an elongated metal plate () having a valve action and coated with a dielectric film (). A conductive layer () is formed to cover the valve-acting metal, with the dielectric film () interposed therebetween. The characteristic impedance as seen from its input terminal can be low over a wide range.

Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same

An element of parallel flat plate line type suitable for operation at a higher speed and with a higher frequency is provided. The element is characterized by including a first metallic memberincluding a flat plate sectionand a projected sectionin which a plurality of projections are formed to stand on one surface of the flat plate sectionin a direction substantially vertical to the surface with gaps therebetween, a second metallic memberincluding a flat plate sectionand a projected sectionin which a plurality of projections are formed to stand on one surface of the flat plate sectionin a direction substantially vertical to the surface with gaps therebetween, and a dielectric filmformed between the projections and the gaps of the element of parallel flat plate line type formed by inserting the projections of the first metallic memberin the gap of the second metallic memberand inserting the projections of the second metallic memberin the gap of the first metallic member, wherein a transmission line is formed between the first metallic memberand the second metallic memberalong the dielectric film, the transmission line being formed to have transmittivity ranging from &#x2212;140 dB to &#x2212;20 dB for a high-frequency electromagnetic wave ranging from 100 kHz to 10 GHz supplied from one terminal.

Element of parallel flat plate line type, a circuit board

A dielectric oxide film is formed on the surface of a valve metal plate formed of aluminum and a conductive polymer layer is provided so as to cover the valve metal plate and the dielectric oxide film. The conductive polymer layer is formed of polyaniline having para-toluenesulfonic acid as a dopant. A conductive carbon paste layer and a silver paste layer are provided at the outer side of the conductive polymer layer and a metal plate, comprising a copper foil, is overlapped onto the silver paste layer. Anode lead terminals are connected to the ends of the valve metal plate and the respective end parts of the metal plate are arranged as cathode lead terminals. A shield strip line device, which is low in impedance, especially in high-frequency ranges of 100 MHz or more, and is favorably adapted to high speed and high frequencies, mainly for use as a bypass device for a noise filter or as a decoupling device, is thus obtained.

Shielded strip line device and method of manufacture thereof

Surface mount type condenser, which is capable of preventing transmission of electromagnetic wave between anode terminals and excellent in its noise removal performance in a high frequency region, having two anode portions and a substantially planar plate-shape first metallic plate sandwiched by two substantially planar plate-shape cathode portions, one of which being formed with a cathode terminal and connected thereto in a manner confronting a substrate, the two anode portions being provided with two anode terminals formed thereon and connected thereto in a manner of confronting the substrate, and characterized in that a substantially planar plate-shape second metallic plate electrically connected to a surface of the other of the cathode portions is provided in a manner of covering a predetermined region of the anode terminals.

Surface mount type condenser

In order to accommodate increasing operation speed of a digital circuit, a distributed constant type noise filter having a low impedance transmission line optimal to provide a power de-coupling of an LSI operating at high speed is provided. Particularly, a capacitor-forming portion of the distributed constant type noise filter is constructed with a solid electrolytic capacitor having a 3-terminal structure. In the distributed constant type noise filter constructed as mentioned, a ratio of width W of the capacitor-forming portion to thickness d of a dielectric member thereof and length L of the capacitor-forming portion are set on the basis of dielectric constant of the capacitor-forming portion such that electric noise generated by an electron device connected thereto are removed over a wide frequency range thereof.

Growing community of inventors

Tokyo, Japan

Koichiro Masuda