Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Koichiro Kawasaki

Taku Kikuchi

Takashi Kitahara

Kazunori Inoue

Tetsuro Okuda

Masahiro Fukushima

Hidefumi Nakanishi

Shintaro Otsuka

Masakazu Atarashi

Hiroki Noto

Morio Takeuchi

Akira Michigami

Tsunekazu Saimei

Yohei Konaka

Takuma Kuzushita

Yasuyuki Toyota

Hiroaki Nakayama

A multiplexer includes first and second filters, a resin layer, and an electrically conductive layer. A pass band of the first filter is different from a pass band of the second filter. The first filter is in contact with an electrically conductive layer, and the second filter is not in contact with the electrically conductive layer. The second filter has a greater thermal resistance value than the first filter, and lowers the pass band in response to a temperature rise. A region of the piezoelectric substrate closer to the first filter is a first region, and a region of the piezoelectric substrate farther from the first filter is a second region. Areas in the first and second regions where an acoustic wave resonator included in a parallel-arm circuit is provided are first and second areas. The second area is greater than the first area.

Acoustic wave device

An electronic device includes an insulation material layer provided on a first main surface of a piezoelectric substrate and surrounding a functional element, and a protective layer provided on the insulation material layer. The piezoelectric substrate and the insulation material layer define a hollow portion accommodating the functional element. The protective layer includes a first portion above the hollow portion, a second portion adjacent to the first portion at one end of the second portion, and a third portion adjacent to the second portion at another end of the second portion. A distance between the first main surface and a surface of the protective layer in the thickness direction is greatest at a location where the second portion is adjacent to or in a vicinity of the first portion, and the distance is shortest at a location where the second portion is adjacent to or in a vicinity of the third portion.

Electronic device and module including the same

An electronic component includes a substrate, a functional element on the substrate, a first electrode, a support body that is made of an insulator, a cover portion, a second electrode, and a projection. The first electrode is located on the substrate and connected to the functional element. The support body protrudes from the substrate and covers the first electrode. The cover portion opposes the substrate, and a hollow space is defined by the substrate, the support body, and the cover portion. The second electrode is located in a via hole extending through the support body and the cover portion and electrically connected to the first electrode. The projection is located on the first electrode in the via hole.

Electronic component and method of manufacturing electronic component

An electronic component includes a substrate, a functional element on the substrate, a support body, a covering portion, and a protective layer covering the covering portion. The support body is provided on the substrate and around a region in which the functional element is located. The covering portion faces the substrate and is supported by the support body. The substrate, the support body, and the covering portion define a hollow space. The functional element is located in the hollow space. In the support body, a surface opposite to a surface facing the substrate is a first surface, and a portion of the protective layer is in contact with the first surface of the support body without the covering portion being interposed.

Electronic component including protective layer

A high-frequency apparatus includes a resin substrate, a first device including a substrate and provided on the resin substrate, and a second device provided adjacent to the first device on the resin substrate. Each of the first device and the second device includes an acoustic wave device. The second device includes a piezoelectric substrate and a functional element provided on the piezoelectric substrate. The substrate of the first device includes Si or a laminated material including Si. The piezoelectric substrate of the second device includes LiTaO, LiNbO, or a laminated material including LiTaOor LiNbO. The resin substrate includes glass.

High-frequency apparatus

An acoustic wave device includes a piezoelectric substrate, functional elements, an outer peripheral support layer, a cover portion, and a protective layer covering the cover portion. A hollow space is defined by the piezoelectric substrate, the outer peripheral support layer, and the cover portion, and the functional elements are disposed in the hollow space. The acoustic wave device further includes an under bump metal layer, a wiring pattern, and a through-electrode that connects these elements. In the protective layer, a through-hole to be filled with a conductor to electrically connect a solder ball and the under bump metal layer is provided. The outer peripheral support layer includes a protruding portion protruding to the hollow space. When the acoustic wave device is seen in plan view, at least a portion of the through-hole overlaps the hollow space, and an end portion of the protruding portion overlaps an inner region of the through-hole.

Acoustic wave device and acoustic wave module including the same

An acoustic wave device includes a substrate, functional elements on a first main surface of the substrate, an outer support portion on the substrate around a region where the functional elements are disposed, a cover portion opposed to the first main surface of the substrate with the outer support portion interposed therebetween, a support portion in a hollow space defined by the substrate, the outer support portion, and the cover portion, a wiring pattern electrically connected to the functional elements, and a through electrode extending through the substrate and electrically connected to the wiring pattern. A gap is provided between the support portion and the cover portion. A distance from the first main surface of the substrate to an upper surface of the support portion is greater than a distance from the first main surface of the substrate to an upper surface of the functional elements.

Acoustic wave device and acoustic wave module including same

In a filter device, a transversal elastic wave filter, which defines a delay element, is connected in parallel with a band pass filter. The transversal elastic wave filter has the same amplitude characteristic as and the opposite phase to the band pass filter at a desired frequency inside an attenuation range of the band pass filter. When a wavelength determined by an electrode finger period of IDTs and is denoted by λ, the distance between the first IDT and the second IDT of the elastic wave filter is about 12λ or less.

Filter device and duplexer

An elastic wave filter apparatus includes at least one excitation electrode, a first electrode land, and second electrode lands provided on a first main surface of a device substrate including a piezoelectric layer. A signal terminal and metal members are provided on a second main surface of the device substrate. The first electrode land and the signal terminal are connected to a signal potential, and the second electrode lands and the metal members are connected to a ground potential. A first connection electrode connects the first electrode land and the signal terminal, and a second connection electrode connects at least one of the second electrode lands and at least one of the metal members. The at least one metal member connected to the second connection electrode overlaps at least a portion of the at least one excitation electrode across the device substrate.

Elastic wave filter apparatus

A circuit module includes a mounting substrate including a conductor wiring, an elastic wave element provided in or on a main surface of the mounting substrate, an electric element provided in or on the main surface, the electric element being different from the elastic wave element, and an insulating resin portion provided in or on the main surface to cover the elastic wave element and the electric element. The elastic wave element and the electric element are connected to each other by the conductor wiring. A height of the elastic wave element is about 0.28 mm or less, which is less than that of the electric element. The thickness of the resin portion in a region in which the resin portion covers the elastic wave element is greater than the thickness of the resin portion in a region in which the resin portion covers the electric element.

Circuit module

An acoustic wave device includes a cover portion, an outer support layer, a support portion, a piezoelectric substrate, and functional elements on the piezoelectric substrate. The outer support layer is on the piezoelectric substrate around a region where the functional elements are disposed. The cover portion is opposed to the piezoelectric substrate with the outer support layer interposed therebetween. The support portion is in a hollow space defined by the piezoelectric substrate, the outer support layer, and the cover portion. The height of the support portion is smaller than that of the outer support layer and larger than that of each of the functional elements. A gap is provided between the support portion and the cover portion or between the support portion and the piezoelectric substrate.

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Nagaokakyo, Japan

Koichiro Kawasaki