Shin-etsu Handotai Co., Ltd.

Fujikoshi Machinery Corp.

Other

Koichiro Ichikawa

Fumihiko Hasegawa

Yasuo Inada

Tatsuo Ohtani

Yasuyoshi Kuroda

Yoshio Nakamura

Toshihiro Tsuchiya

Yasuyoshi Kuroka

Tsuyoshi Hasegawa

Yoshinobu Nishimoto

Masumi Iihama

Unkai Sato

The method of polishing a work is capable of reducing a polishing cost, polishing a surface of the work with high polishing accuracy and easily disposing used polishing liquid and used washing liquid. The method comprises the steps of: pressing the work onto a polishing member; feeding polishing liquid; and relatively moving the work with respect to the polishing member. Electrolytic reduced water produced by electrolyzing an electrolyte solution is used as the polishing liquid.

Polishing apparatus and method of polishing work

A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed N,has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed N,according to the detected wafer mirror-like polishing position.

Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat

A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed N.sub.s has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed N.sub.s according to the detected wafer mirror-like polishing position.

Method of and apparatus for mirror-like polishing wafer chamfer with

A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.

Apparatus for polishing peripheral portion of wafer

An apparatus for polishing the notch of a wafer in an effective and efficient way, which comprises: a flexible tape carrying abrasive grains in the working face thereof; an infeed reel for feeding the tape stored thereon: a take-up reel for taking up the tape fed from the infeed reel; a motor for driving to rotate the take-up reel; a means for blowing a fluid to the backside surface to the edge portion of the notch to be in direct contact along the full periphery of the notch; and a means for oscillating the tape sideways.

Apparatus for polishing the notch of a wafer

A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.

Method for mirror-polishing chamfered portion of wafer and

An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abrasive grains thereon; a feed reel for feeding the tape stored by winding itself; a take-up reel for taking up the tape by winding itself; a rotary drum inside of which both of the reels are equipped in such a manner that they are mountable or demountable, where a portion of the tape in the way from the feed reel to the take-up reel is adaptive to wind the rotary drum around the outer cylindrical surface thereof in close contact in the shape of a helicoid and one of the main faces of the wafer is positioned to be in a plane intersecting the central axis of the rotary drum at an angle.

Apparatus for polishing the periphery portion of a wafer

A polishing apparatus which can effectively polish a bottom wall of a wafer in the notch portion is disclosed. The polishing apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a movable linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member such as a pulse motor for turning the rotary buff around a predetermined axis so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.

Apparatus for polishing notch portion of wafer

An polishing apparatus which can effectively polish a bottom wall of a wafer in a notch portion is disclosed. The apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member for turning the table around a predetermined axis which is approximately parallel with the rotary axis of the rotary buff so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.

Growing community of inventors

Nagano, Japan

Koichiro Ichikawa