Senju Metal Industry Co., Ltd.

Koichiro Hosokawa

Yuta Saito

Takashi Sugihara

Hiroshi Taguchi

Tsutomu Hiyama

Daisuke Kasahara

A soldering apparatus includes transfer rails as a first transfer means for transferring a printed circuit board, transfer rails as a second transfer means provided in parallel to a transfer direction of the printed circuit board to be transferred by the transfer rails, a muffle as a first reflow furnace main body for heating the printed circuit board transferred by the transfer rails, a muffle as a second reflow furnace main body for heating a printed circuit board transferred by the transfer rails, and a main frame as a frame for housing the muffle and the muffle. The main frame includes an opening/closing part as a first opening/closing means for opening/closing the muffle, and an opening/closing part as a second opening/closing means for opening/closing the muffle.

Reflow soldering apparatus having independently openable main bodies

To prevent evaporated flux from being attached to rotation axes of motors which rotate fans positioned in a preheating zone, a main heating zone and a cooling zone and being solidified, the evaporated flux is efficiently and surely collected with the flux liquefying before the flux is solidified and having fluidity. A drain portionconstituting a flux collection apparatusA is formed at a side of a motor baseopposed to the fan and at a circumferential portion of the rotation axis. A surface of the drain portionopposed to the fan is formed as an inclined surfaceA which is inclined from a level position of the motor baseto a discharge portprovided at a back side of the motor baseThe flux collected to a center portion of the motor baseby the rotation drive of the fan is flown to the drain portionformed in the center portion of the motor base, is flown along the inclined surfaceA and contained into a collection containerfrom the drain portionthrough the discharge port, a drain pipe and a pipe

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Saitama, Japan

Koichiro Hosokawa