Koa Corporation

Ntn Corporation

National Institute of Technology

Koichi Urano

Kenichi Iguchi

Yusuke Shibuya

Yasushi Akahane

Natsuki Iguchi

Natsumi Shiobara

Hisakazu Nagata

Daichi Kondou

Homare Kaneko

Yukiko Ota

Kenji Obata

Yuya Iguchi

Shigenori Matsushima

The gas sensor is provided with: a base material; a first electrode and a second electrode arranged on the base material; and a gas detection member connected to the first electrode and the second electrode, wherein the gas detection member contains flaky particles of alkaline earth ferrite.

Gas sensor and method for producing alkaline earth ferrite

A load sensor element includes a substrate made of a ceramic material; an inorganic layer having a surface configured to receive a load, the inorganic layer covers a portion of the substrate; a thin-layer resistance body whose resistance value changes in accordance with the load received by the inorganic layer, the thin-layer resistance body having a main body portion and a pair of end portions, the main body portion mounted on the covered portion of the substrate and sandwiched between the substrate and the inorganic layer, the pair of end portions mounted on an exposed portion of the substrate, and the exposed portion free of the inorganic layer; and a pair of electrodes electrically connected to the pair of end portions of the thin-layer resistance body and separated away from the inorganic layer and on one side of the substrate.

Load sensor element and manufacturing method of load sensor element

This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.

Thick-film resistive element paste and use of thick-film resistive element paste in resistor

Disclosed is a chip resistorthat includes a ceramic substrate, a pair of bank-raising foundation sectionspositioned on both longitudinal ends of the lower surface of the ceramic substrate, a pair of first electrode layersthat cover at least parts of the bank-raising foundation sectionsand are positioned at a predetermined distance from each other, a resistive elementthat is made mainly of a copper-nickel alloy to bridge the first electrode layers, a pair of second electrode layersthat cover the pair of first electrode layers, and an insulating protective layerthat covers the resistive element. Further, end-face electrodesare positioned on both longitudinal end faces of the ceramic substrate. The second electrode layersand end-face electrodesare covered with plating layers-. This chip resistoris to be face-down mounted with the first and second electrodespositioned on a wiring patternof a circuit board

Chip resistor

The chip resistorincludes a ceramic substratethat is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrateare a resistive elementthat is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layersthat form a two-layer structure and cover both longitudinal ends of the resistive element, and an insulating protective layerfor covering the remaining area of the resistive element. The resistive elementis positioned within a region inside the peripheral border of the lower surface of the ceramic substrate. The chip resistoralso includes end-face electrodesthat are positioned on both longitudinal end faces of the ceramic substrate. The second electrode layersand end-face electrodesare covered by plating layers-. This chip resistoris to be face-down mounted with both electrode layerspositioned on a wiring patternof a circuit board

Growing community of inventors

Nagano, Japan

Koichi Urano