Tokyo Shibaura Denki Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Koichi Teshima

Michihiko Inaba

Yasuhisa Ohtake

Izuru Komatsu

Shin-ichi Nakamura

Emiko Higashinakagawa

Masahiro Tadauchi

Masaharu Kanto

Toshiharu Sakurai

Cao Minh Thai

Hiroshi Tateishi

Tetsuji Hori

Masato Sakai

Eiichi Akiyoshi

Masakazu Yamada

Takemi Abe

Seika Matidori

Yoshinori Fujimori

Hisato Kihara

Masayuki Fukuda

A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.

Mounting material, semiconductor device and method of manufacturing semiconductor device

Disclosed is a shadow mask plate material which consists of an Fe-Ni-based alloy containing iron and nickel as main constituents, has an unrecrystallized texture with a grain size of 10 .mu.m or less, and is excellent in etching characteristics for forming electron beam apertures.

Shadow mask plate material and shadow mask

A color cathode ray tube having a mask frame, a shadow mask attached to the mask frame and inner shield attached to the mask frame. At least one of these parts is made substantially of iron (Fe) and has a oxidized layer on its surface. That part further includes silicon (Si), aluminum (Al) and chromium (Cr) as impurity elements in weight amounts satisfying the following relation:

Color cathode ray tube with frame, mask or shield having an oxidized

An electronic part composed of an alloy comprising, as a basic metal or metals, Cr and Zr with the total amount thereof being between 0.3 and 2.0% by weight (provided that the amount of Cr is 1.5% by weight or less and that of Zr is 1.0% by weight or less) and Cu as a balance, the surface of said part having been coated with Sn. The electronic part according to the present invention is excellent in the wetting property of a solder, weather resistance of a solder and bonding property to Au and Al.

Electronic parts

A copper alloy is produced by introducing copper base metal in a crucible, i.e. part of the metal copper is put in the crucible after introduction of the additives into the crucible for rapidly cooling the melt to a casting temperature.

Method of producing copper alloy by melting technique

Growing community of inventors

Tokyo, Japan

Koichi Teshima