Sumitomo Bakelite Company Limited

Koichi Tanaka

Tsutomu Watanabe

Shigenori Yamaoka

As an adhesive used for a laminate for a flexible printed circuit, there is provided an adhesive composition comprising as the essential components a polyester resin, an isocyanate compound, and a B-stage epoxy resin. This composition is excellent in flow property and rapid curability and is suitable for use in a continuous adhesion between a plastic insulating film and a conductive foil by means of a roll-laminator and it affords an excellent characteristic to the laminate a printed circuit. There is also provided an adhesive composition which contains, in addition to the above ingredients, a styrene copolymer comprising maleic anhydride, or an alkyl maleate as a structural unit, or a metallic salt of an aliphatic carboxylic acid in order to prevent blocking and promote curing of the adhesive in a roll laminating process. The addition of a small amount of a pigment results in an adhesive composition which is effective in the economical production of a laminate for a colored flexible printed circuit, and which has the effect of preventing the blocking and improving the weather resistance of the adhesive.

Growing community of inventors

Yokohama, Japan

Koichi Tanaka