Kobe Steel, Ltd.

Shinko Leadmikk Co., Ltd.

Kabushiki Kaisha Kobe Seiko Sho

Koichi Taira

Yasushi Masago

Toshiyuki Mitsui

Junichi Kakumoto

Masayasu Nishimura

A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 &#x3bc;m to 4.0 &#x3bc;m in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from 0.01 mm to 0.3 mm in the direction, skewness of less than 0, and protrusion peak portion height of 1 &#x3bc;m or less. A Sn surface coating layer group X as a plurality of parallel lines is included, and a Cu&#x2014;Sn alloy coating layer is adjacent to each side of each Sn coating layer. Maximum height roughness is 10 &#x3bc;m or less in a direction of part insertion. The sheet is surface-roughened by pressing when stamped, thereby forming depressions as a plurality of parallel lines in its surface. The sheet is then plated with Cu and Sn, followed by reflowing.

Method for producing a mating-type connecting part

A mating-type connecting part can be obtained by stamping and surface-roughening a copper sheet into a predetermined shape with depressions as a plurality of parallel lines. The copper sheet then has a roughness of from 0.5 &#x3bc;m to 4.0 &#x3bc;m parallel to a sliding direction upon connection, a mean projection-depression interval of from 0.01 mm to 0.3 mm in that direction, a skewness less than 0, and a protrusion peak portion height of 1 &#x3bc;m or less. The copper sheet is then plated with Cu and Sn, followed by reflowing. The result is a connecting part having a Sn surface coating layer group as a plurality of parallel lines, and a Cu-Sn alloy coating layer adjacent to each side of each Sn surface coating layer.

Copper alloy and electrically conductive material for connecting parts, and mating-type connecting part and method for producing the same

The invention forms a Sn coating layer and a Cu&#x2014;Sn alloy coating layer having a suitably controllable planar shape in a PCB terminal. A group of Sn coating layers being as a plurality of essentially parallel lines is formed as the surface coating layer, and a Cu&#x2014;Sn alloy coating layeris exposed on the outermost surface on both sides of Sn coating layers each constituting the group of Sn coating layers. The Sn coating layers have a width of 1 to 500 &#x3bc;m, an interval between adjacent Sn coating layers is 1 to 20000 &#x3bc;m, and an outermost maximum height roughness in a terminal insertion direction is at most 10 &#x3bc;m.

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Shimonoseki, Japan

Koichi Taira