Mitsubishi Electric Corporation

Koichi Taguchi

Shoji Saito

Yuki Hata

Takeshi Omaru

Hideo Komo

Naohiro Ogushi

A control unit () generates a control signal. A switching device () performs switching according to the control signal and generates a primary side input voltage from a supply voltage. A transformer () converts the primary side input voltage to a secondary side output voltage. A drive circuit () drives a power device () according to the secondary side output voltage. The control unit () includes a table listing a correspondence relationship between supply voltages and set values of control signals for obtaining a desired secondary side output voltage, refers to the table and generates the control signal having a set value corresponding to the supply voltage.

Power device drive apparatus and method for manufacturing the same

A case () surrounds a semiconductor chip (). A case electrode () is attached to an upper face of the case (). A wire () is connected to the semiconductor chip () and the case electrode (). A first holding portion () presses down the case electrode () on the upper face of the case () outside a joint portion where the wire () is bonded to the case electrode (). A second holding portion () presses down the case electrode () on the upper face of the case () inside the joint portion. A recess () is formed on the upper face of the case (). The case electrode () is bent such as to fit into the recess (). The second holding portion () is disposed inside the recess ().

Semiconductor device

First and second circuits, a photocoupler and a substrate temperature monitor circuit are formed on a substrate. A photocoupler includes a primary-side light emitting diode that converts an electric signal received from the first circuit into an optical signal, and a light receiving device that converts the optical signal into an electric signal and outputs the electric signal to the second circuit. The substrate temperature monitor circuit reads a Vf voltage value of the primary-side light emitting diode of the photocoupler to monitor temperature of the substrate.

Semiconductor device with substrate temperature monitor circuit

It is an object of the present invention to provide a semiconductor device that has sufficient insulation properties between a screw and a heat dissipation plate, and is smaller and less costly. A semiconductor device of the present invention includes the following: a housing containing a semiconductor element; a heat dissipation plate disposed on a bottom surface of the housing, and provided to partly extend beyond the housing to reach the outside; an electrode electrically connected to the semiconductor element, and provided to partly protrude from the housing to the outside in parallel with the heat dissipation plate; and a screw with which an exposed portion of the electrode, protruding from the housing is joined to a busbar. The heat dissipation plate has a thickness lack portion in a location of the heat dissipation plate, the location at least facing the screw, the location being on a screw side.

Growing community of inventors

Tokyo, Japan

Koichi Taguchi