Sumitomo Electric Industries, Limited

Koichi Sogabe

Akira Yamakawa

Masaya Miyake

Hitoyuki Sakanoue

Hisao Takeuchi

Kenichi Watatani

Miki Miyanaga

Takao Nishioka

Akira Sasame

Keizo Harada

Takashi Matsuura

Kenji Matsunuma

Katsuhito Yoshida

Yoshiyuki Hirose

Hideaki Awata

Kenichi Watanabe

Takehisa Yamamoto

Sadamu Ishidu

Kenichi Kurisu

Toshiyuki Kosuge

Noboru Uenishi

Yuka Kondo

Tomoyuki Awatsu

Yasushi Itoh

There is provided an oxide sintered body including indium, tungsten and zinc, wherein the oxide sintered body includes a bixbite type crystal phase as a main component and has an apparent density of higher than 6.5 g/cmand equal to or lower than 7.1 g/cm, a content rate of tungsten to a total of indium, tungsten and zinc is higher than 1.2 atomic % and lower than 30 atomic %, and a content rate of zinc to the total of indium, tungsten and zinc is higher than 1.2 atomic % and lower than 30 atomic %. There are also provided a sputtering target including this oxide sintered body, and a semiconductor device including an oxide semiconductor film formed by a sputtering method by using the sputtering target.

Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device

There is provided an oxide sintered body including indium, tungsten, and at least one of zinc and tin, wherein the oxide sintered body includes, as a crystal phase, a complex oxide crystal phase including tungsten and at least one of zinc and tin. There is also provided a semiconductor device including an oxide semiconductor film formed by a sputtering method by using the oxide sintered body as a target.

Oxide sintered body and semiconductor device

An oil pump that can be reduced in weight and is excellent in wear resistance and easy to manufacture is provided. The oil pump includes an oil pump housing formed of aluminum alloy, and an inner rotor and an outer rotor that slide along the oil pump housing with contact kept therebetween to suck and discharge oil. Composite layers including porous metallic bodies are arranged at parts of the oil pump housing that contact the inner rotor and the outer rotor. Pores of the porous metallic bodies are impregnated with the aluminum alloy constituting the oil pump housing.

Oil pump

Joint body of aluminum and silicon nitride and method of preparing the

A silicon nitride sintered body comprising 3.5% by weight or less of aluminum, 3.5% by weight or less of oxygen and the balance of silicon nitride; and a silicon nitride sintered body comprising 90% by weight or more of silicon nitride, 3.5% by weight or less of aluminum, 3.5% by weight or less of oxygen and from 0.01 to 10% by weight of at least one metallic element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Fin, Fe, Co, Ni, Nd, and Ho. These sintered bodies have a density of 3.15 g/cm.sup.3 or more and a thermal conductivity of 40 W/mK or more.

Silicon nitride sintered body

This invention provides composite ceramic powder comprising matrix ceramic powder and fine particles of ceramic, metal or metal compound which are different from the matrix ceramic powder and dispersed in the matrix ceramic powder. The composite ceramic powder is produced by mixing matrix ceramic powder or its precursor with fine particles to be dispersed therein and then heating the resulting mixture. The composite ceramic powder is also produced by dispersing matrix ceramic particles or precursor thereof in an organic solvent with an organic compound as a dispersoid particle precursor and separating and recovering the organic solvent. The composite ceramic powder is suitable for producing sintered bodies having excellent properties, especially with respect to thermal conductivity, flexural strength and light transmittance, by a conventional ceramic fabrication process.

Composite ceramic powder and production process thereof

The present invention provides a sintered body of aluminum nitride comprising (i) aluminum nitride as a main component and (ii) at least one component selected from the group consisting of Zr, Hf, V, Nb, Ta, Cr, Mo, W, Fe, Co, Ni, Nd, Ho, Ti and compounds thereof in the total amounts of not greater than 1.0 wt. % and not less than 0.01 wt. % in terms of elements on the basis of sintered body, the sintered body being colored and having a thermal conductivity of at least 150 W/mK. The sintered body is useful for the preparation of circuit boards having printed circuits thereon and highly heat-releasing ceramic packages for semiconductive devices.

Sintered body of aluminum nitride

The present invention provides a sintered body of aluminum nitride comprising (i) aluminum nitride as a main component and (ii) at least one component selected from the group consisting of Zr, Hf, V, Nb, Ta, Cr, Mo, W, Fe, Co, Ni, Nd, Ho, Ti, and compounds thereof in the total amounts of not greater than 1.0 wt. % and not less than 0.01 wt. % in terms of elements on the basis of sintered body, the sintered body being colored and having a thermal conductivity of at least 150 W/mK. The sintered body is useful for the preparation of circuit boards having printed circuits thereon and highly heat-releasing ceramic packages for semiconductive devices.

The present invention provides a sintered body of aluminum nitride comprising (i) aluminum nitride as a main component and (ii) at least one component selected from the group consisting of Zr, Hf, V, Nb, Ta, Cr, Mo, W, Fe, Co, Ni, Nd, Ho, Ti and compounds thereof in the total amounts of not greater than 1.0 wt.% and not less than 0.01 wt.% in terms of elements on the basis of sintered body, the sintered body being colored and having a thermal conductivity of at least 150 W/mK. The sintered body is useful for the preparation of circuit boards having printed circuits thereon and highly heat-releasing ceramic packages for semiconductive devices.

A glass-aluminum nitride composite comprising a sintered body is produced by adding glass powder to aluminum nitride grains having an oxygen content of less than 2% and a mean grain diameter of 1.0 .mu.m or more and subjecting the mixture to molding and sintering. A suitable glass is one based on borosilicate and the addition of an AlN whisker serves to improve the strength. The composite material of the present invention has a high heat conductivity, a low permittivity and a high strength and is suitable as a semiconductor packaging material.

Glass-aluminum nitride composite material

Disclosed is a silicon nitride sintered body produced by subjecting a green compact of a mixed powder composed of 1) a silicon nitride powder having a percentage .alpha. crystallization of 93% or more and a mean grain diameter of 0.7 .mu.m or less and 2) 5 to 15% by weight in total of a first sintering aid selected from among rare earth element, yttrium oxide and lanthanide oxides and a second sintering aid consisting of aluminum oxide or nitride and at least one selected from among oxides and nitrides of Mg, Ca and Li, to primary sintering in a nitrogen gas atmosphere under a pressure of 1.1 atm or less at 1500.degree. to 1700.degree. C.; and subjecting the sintered body to secondary sintering in a nitrogen gas atmosphere under a pressure of 10 atm or more at the primary sintering temperature or below, thereby giving a sintered body wherein the relative density of the sintered body is 99% or more and the precipitation ratio of an .alpha.-Si.sub.3 N.sub.4 (including .beta.'-sialon) crystal phase ranges from 1:3 to 1:8 in terms of the peak intensity ratio in X-ray diffraction.

Silicon nitride sintered body and process for producing the same

An aluminum nitride sintered body is mainly composed of aluminum nitride, contains 0.01 to 1.0 percent by weight of a rare earth element and 0.001 to 0.5 percent by weight of oxygen, and has thermal conductivity of at least 180 W/mK. According to a method of manufacturing such an aluminum nitride sintered body, aluminum nitride powder (201) is first prepared. At least one compound (203) containing a rare earth element is added to the aluminum nitride powder (201) to contain 0.01 to 1.0 percent by weight, in rare earth element conversion, of the compound, to be homogeneously mixed with each other. A formed body obtained by forming such mixed powder is sintered in a non-oxidizing atmosphere containing nitrogen at a temperature of 1500 to 2200.degree. C.

Heat-conductive aluminum nitride sintered body and method of

An aluminum nitride sintered body mainly composed of aluminum nitride, contains 0.01 to 1.0 percent by weight of a rare earth element and 0.001 to 0.5 percent by weight of oxygen. Such a body has a thermal conductivity of at least 180 W/mK. For manufacturing such an aluminum nitride sintered body, aluminum nitride powder (201) is first prepared. At least one compound (203) containing a rare earth element is added to the aluminum nitride powder (201) to contain 0.01 to 1.0 percent by weight, in rare earth element conversion, of the compound. The ingredients are homogeneously mixed with each other. A green body is formed of the mixed powder and sintered at a temperature of 1500.degree. to 2200.degree. C. in a non-oxidizing atmosphere containing nitrogen.

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Itami, Japan

Koichi Sogabe