Canon Kabushiki Kaisha

Shimadzu Corporation

Koichi Shimizu

Tsutomu Murakami

Koji Tsuzuki

Yoshifumi Takeyama

Takehito Yoshino

Satoru Hamasaki

Shozo Kasai

Shuichi Chiba

Tadashi Kosaka

Kazuya Notsu

Tsunenobu Satoi

Yu Katase

Masayuki Kusakari

Yoshimitsu Hayashi

Satoru Yamada

Hisatane Komori

Osamu Ashida

Ichiro Kataoka

Hidenori Shiotsuka

Masahiro Mori

Akiharu Takabayashi

Masaaki Matsushita

Ayako Komori

Takeshi Takada

Shigeo Kiso

Hideaki Zenko

Taiki Nishimura

Ikuto Kimura

Kouji Tsuzuki

Yoshifumi Murakami

A head mounted display includes a display device having a display surface, an optical system configured to adjust a focal point of an eye of an observer to the display device, a driving mechanism configured to drive the display device, a line-of-sight detector configured to detect a line of sight of the observer, and a controller configured to control, based on an output from the line-of-sight detector, the driving mechanism so that an angle formed by the line of sight and the display surface falls within a preset allowable range with respect to 90° at an intersection point of the line of sight and the display surface.

Head mounted display and cross reality system

A turbo-molecular pump comprises: a turbine pump portion having rotor blades and stator blades arranged in multiple stages in an axial direction; a drag pump portion provided on a downstream side of the turbine pump portion; a case housing the turbine pump portion; a base housing the drag pump portion; and a temperature adjustment unit provided between the case and the base. The temperature adjustment unit includes a temperature adjustment spacer forming a pump casing together with the case and the base and, the temperature adjustment unit includes a cooler, a heater, and a temperature detector which are provided at the temperature adjustment spacer.

Turbo-molecular pump

A method of manufacturing a package unit, comprising: preparing a circuit board having a first region, a second region surrounding the first region, and a third region between the first and the second region; preparing a mold having a frame-shaped protruding portion surrounding a first cavity, the frame-shaped protruding portion partitioning the first cavity and a second cavity surrounding the first cavity; arranging the circuit board and the mold such that the first region of the circuit board faces the first cavity, the second region of the circuit board faces the second cavity, and a gap which communicates the first cavity and the second cavity with each other is formed between the frame-shaped protruding portion and the third region of the circuit board; and forming a frame-shaped resin member on top of the second region of the circuit board by pouring a resin into the second cavity.

Method of manufacturing package unit, package unit, electronic module, and equipment

Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.

Electronic module and imaging system

A vacuum pump comprises: a rotor provided with multiple stages of rotor blades; a base including a ball bearing configured to rotatably support the rotor; an outer cylinder covering the rotor and connected to the base; and a control device including an electronic circuit having a heat generation element. The control device is provided in contact with the outer cylinder.

Vacuum pump with control device in relation to outer cylinder

According to the disclosure, a relationship of Tgp&#x3e;Tgf, &#x3b1;f1&#x3c;&#x3b1;PCB1, and (Tgp&#x2212;To)&#xd7;&#x3b1;PCB1&#x3c;(Tgf&#x2212;To)&#xd7;&#x3b1;f1+(Tgp&#x2212;Tgf)&#xd7;&#x3b1;f2 or a relationship of Tgp&#x3c;Tgf, &#x3b1;PCB1&#x3c;&#x3b1;f1, and (Tgf&#x2212;To)&#xd7;&#x3b1;f1&#x3c;(Tgp&#x2212;To)&#xd7;&#x3b1;PCB1+(Tgf&#x2212;Tgp)&#xd7;&#x3b1;PCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as &#x3b1;PCB1 and &#x3b1;PCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as &#x3b1;f1 and &#x3b1;f2, respectively, and a room temperature is denoted as To.

Imaging device module, imaging system, imaging device package, and manufacturing method

A center ring interposed between a vacuum chamber and a vacuum pump, comprises: a ring main body including a first ring fitting portion to be fitted in a chamber-side fitting portion of the vacuum chamber and a second ring fitting portion to be fitted in a pump-side fitting portion of the vacuum pump; a foreign particle entrance prevention member provided at the ring main body; and a dropping prevention structure configured to prevent the center ring from dropping from the pump-side fitting portion of the vacuum pump.

Center ring and vacuum pump

A vacuum pump for rotary driving a rotor by a motor to perform vacuum pumping, wherein a motor rotor of the motor includes a yoke fixed to a shaft of the rotor, and a permanent magnet held at the yoke, and the yoke includes a holding portion provided apart from the shaft and configured to hold the permanent magnet, and a pair of fitting portions provided respectively at both ends of the holding portion in an axial direction and bonded to the shaft by fitting, and a radial thickness dimension of each fitting portion is set less than that of the holding portion.

Vacuum pump

Provided is an electronic component including: a base member; an electronic device fixed on the base member; and a lid member arranged over the electronic device and fixed on the base member. A primary material of the lid member is a crystal quartz, the lid member has two primary faces opposing to the electronic device and four side faces, and each of the four side faces is a wet-etched face that is not parallel to an optical axis of the crystal quartz.

Electronic component, manufacturing method of electronic component, and electronic equipment

A method of manufacturing a ceramic package is provided. An electrically conductive paste is applied to an inside of the first hole and an inside of the second hole of a ceramic green sheet. A ceramic member including first and second electrically conductive members is formed by burning the ceramic green sheet. The ceramic member is divided so as to divide each of the first and second electrically conductive members. A distance between first and second connecting portions is smaller than each of a length of the first connecting portion in a first direction and a length of the second connecting portion in a second direction. The length of the first connecting portion in the first direction is larger than a length of the first connecting portion in a third direction. The length of the second connecting portion has a similar relation.

Ceramic package, method of manufacturing the same, electronic component, and module

A vacuum pump comprises: a ball bearing which supports a rotor; a holding section which elastically holds an outer ring of the ball bearing; and a grease which is filled between the outer ring and the holding section, the grease having a consistency of NLGI No. 1.5 or less.

A solid state apparatus comprising, a printed circuit board having a first and a second surface that are opposite surfaces, a semiconductor chip for imaging arranged on the first surface, a sealing resin arranged to cover the printed circuit board and the semiconductor chip, and a translucent member arranged on the sealing resin, the solid state apparatus having a first region located inward of an outer edge of the semiconductor chip, and a second region located outward of the outer edge, the printed circuit board comprising, on the first surface, a first terminal electrically connected to the semiconductor chip, and comprising, on the second surface, a second terminal electrically connected to the first terminal within the printed circuit board, the second terminal being arranged in the first region.

Solid state apparatus

A first rigid body has a horizontal surface on which a composite is to be placed and a non-horizontal surface on which the composite is not to be placed, with the horizontal surface and the non-horizontal surface forming a continuous horizontal linear edge. The continuous horizontal linear edge has a first portion, which is an edge of the non-horizontal surface, and a second portion, which is an edge of the horizontal surface, and the composite has a first region provided with a first member and a second region provided without the first member. While the composite is placed so that the first portion corresponds to the first region or the first region and a part of the second region and that the second portion corresponds to the remaining second region, the composite is separated by moving down a second rigid body from above the substrate.

Method and apparatus for separating composite

A method of manufacturing a photovoltaic device includes: a step of fixing thin metal wires which are coated with electroconductive resin, to a principal surface of a photovoltaic member; a step of heating the photovoltaic member to which the thin metal wires are fixed; and a step of pressing an elastic film against the photovoltaic member and the thin metal wires while the pressure of gas on the side opposite the photovoltaic member across the elastic film is larger than the pressure of gas on the photovoltaic member side. The thin metal wires to serve as a collector electrode provided in a photovoltaic member are prevented from bending. This makes it possible to produce, with high yield, photovoltaic devices that have no fear of being reduced in output by bent thin metal wires.

Growing community of inventors

Kyoto, Japan

Koichi Shimizu