Jtekt Corporation

Koichi Shiiba

Takaya Nagahama

Makoto Tano

Yoshinori Imoto

Kohei Kato

Takashi Mizoguchi

Keisuke Usuda

Masato Ito

Sho Hasegawa

A composite processing machine includes: a holding portion capable of holding a workpiece; a removal processing portion that performs removal processing on the workpiece held by the holding portion, the removal processing portion being capable of performing removal processing of a hard material; an additive manufacturing portion that applies the hard material to a surface of the workpiece held by the holding portion by melting the hard material while supplying the hard material to the surface; and a control unit that controls the composite processing machine. The control unit is configured to: control the additive manufacturing portion to form an additive portion made of the hard material on the surface of the workpiece held by the holding portion; and control the removal processing portion to perform the removal processing on the additive portion formed on the workpiece held by the holding portion.

Composite processing machine

There is provided an additive manufacturing device including a control device of controlling a relative posture of a heat retaining light beam irradiation device to a melting light beam irradiation device, in a state where a heat retaining light irradiation range of a heat retaining light beam larger than a melting light irradiation range of a melting light beam is overlapped with the melting light irradiation range, and such that a size of the heat retaining light irradiation range is changeable with respect to a size of the melting light irradiation range.

Additive manufacturing device

A bonding method includes: an oxide-film forming step, on an irradiated surface, an oxide film having a film thickness corresponding to a first output and an irradiation time of an oxide-film-forming laser beam; a first reflected-laser-beam detection step of detecting a second output; a first absorptance computing step of computing a first absorptance for the oxide-film-forming laser beam; laser-beam switching step of switching the oxide-film-forming laser beam radiated onto the irradiated surface to a heat-bonding laser beam; and a heat bonding step of heating a first bonding surface until the temperature thereof reaches a predetermined bonding temperature, and bonding the first bonding surface to a second bonding surface.

Bonding method and bonding device for metal member

A heating method includes an oxide film forming step and a heating step. The thickness of an oxide film is set in a first range that includes a first maximal thickness and a second maximal thickness and that is smaller than a second minimal thickness in the relationship with the laser absorption having a periodic profile. The first maximal thickness corresponds to a first maximal value a of the laser absorption. The second maximal thickness corresponds to a second maximal value of the laser absorption. The second minimal thickness corresponds to a second minimal value of the laser absorption, namely the minimal value of the laser absorption that appears between the second maximal value and a third maximal value, or the maximal value of the laser absorption that appears subsequent to the second maximal value.

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Nisshin, Japan

Koichi Shiiba