Sekisui Chemical Co., Ltd.

Koichi Shibayama

Naoki Ueda

Juichi Fukatani

Koichiro Iwasa

Hidenobu Deguchi

Akihiko Fujiwara

Masao Ogasa

Motohiro Yagi

Hiroki Erami

Koji Yonezawa

Koji Taniguchi

Hideyuki Takahashi

Akihiko Bando

Nobuhiro Goto

Toshihiro Arai

Kazuyoshi Shiomi

Kazunori Akaho

Eiichi Takahashi

A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (&#x3b1;2) of 1.0&#xd7;10[&#xb0; C.] or below over the temperature range from a temperature 10&#xb0; C. higher than a glass transition temperature of the resin composition to a temperature 50&#xb0; C. higher than the glass transition temperature of the resin composition.

Resin composition

A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.

Thermosetting resin composition, resin sheet and resin sheet for insulated substrate

A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. The resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of a layered silicate inorganic compound, the resin composition having a mean linear expansion coefficient (&#x3b1;2) of up to 17&#xd7;10[&#xb0; C.] over the temperature range from a temperature 10&#xb0; C. higher than a glass transition temperature of the resin composition to a temperature 50&#xb0; C. higher than the glass transition temperature of the resin composition.

Resin composition of layered silicate

A thermoplastic foam is provided which contains a thermoplastic resin and a layered silicate and in which foam cells and the layered silicate are evenly and finely dispersed. A volume-expansible gas or heat decomposable blowing agent is incorporated into interlayer spaces of a layered silicate in a composite material containing 100 parts by weight of a thermoplastic resin and 0.1&#x2013;50 parts by weight of the layered silicate, and the gas or blowing agent is allowed to expand in volume or thermally decompose to form foam cells, so that a thermoplastic foam is obtained in which the layered silicate has an average interlayer spacing of over 60 &#x212b; when determined by an X-ray diffractometry.

Thermoplastic foam and method for production thereof

It is an object of the present invention to provide a polyolefin resin composition excellent in flame retardancy, in particular capable of manifesting excellent flame retardancy owing to a shape retaining effect upon combustion, and excellent also in mechanical strength and thermal characteristics, a thermoplastic resin for cable jacketing or sheathing which comprises the above resin composition, and an insulated cable. The present invention relates to a polyolefin resin composition comprising

Polyolefin resin composition

A thermoplastic foam is provided which contains a thermoplastic resin and a layered silicate and in which foam cells and the layered silicate are evenly and finely dispersed. A volume-expansible gas or heat decomposable blowing agent is incorporated into interlayer spaces of a layered silicate in a composite material containing 100 parts by weight of a thermoplastic resin and 0.1-50 parts by weight of the layered silicate, and the gas or blowing agent is allowed to expand in volume or thermally decompose to form foam cells, so that a thermoplastic foam is obtained in which the layered silicate has an average interlayer spacing of over 60 &#x212b; when determined by an X-ray diffractometry.

Process for preparing polymer by using copper compound

The invention provides an expandable polyolefin resin composition comprising (a) 40 to 100 wt. % of a polypropylene resin having a melt index of 0.5 to 12, (b) 0 to 60 wt. % of a polyethylene resin having a melt index of 2 to 50 (c) 0.5 to 10 parts by weight of the di(meth)acrylate of an aliphatic dihydric alcohol having a methylene group with 2 to 18 carbon atoms between the (meth)acryloyloxy groups at both ends per 100 parts by weight of the combination of the resins (a) and (b), and (d) 1 to 50 parts by weight of a thermally decomposable blowing agent. Preferably the composition further comprises (e) 0.5 to 5 parts by weight of a monofunctional monomer. When uniformly crosslinked, the composition affords an expandable polyolefin resin composition suited to production of a crosslinked polyolefin resin foam excellent in heat resistance, toughness and moldability of formability and appearing homogeneous.

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Osaka, Japan

Koichi Shibayama