Du Pont-Mitsui Polychemicals Co., Ltd.

Mitsui Chemicals Tohcello, Inc.

Dow-Mitsui Polychemicals Co., Ltd.

E.i. Dupont De Nemours and Company

Koichi Nishijima

Akira Yamashita

Hisao Gonohe

Tetsuya Nakamura

Manabu Kawamoto

Bernard Rioux

Kenji Miharu

Yoshitaka Hironaka

Yasuki Shibata

Rie Sato

Koji Kawano

Hiroaki Machiya

Masataka Aoyama

The present invention provides a resin composition which includes: carbon nanotubes (A); and a resin (B) which is at least one selected from the group consisting of: an ionomer of an ethylene-unsaturated carboxylic acid copolymer (B1); and an ethylene-unsaturated carboxylic acid copolymer (B2).

Resin composition and molded product

A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane. A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.

Resin composition for sealant, laminate, packaging material, and package

Provided is a sheet for a solar cell encapsulant containing (A) an ethylene-based polymer having a melting point of 90&#xb0; C. or higher and containing an ethylene-derived constituent unit as a main component; (B) an ethylene-vinyl acetate copolymer having a vinyl acetate-derived constituent unit at a content ratio of from 19% to 40% by mass; and (C) a silane coupling agent having an amino group. The sheet for solar cell encapsulant has the excellent transparency and flexibility possessed by an ethylene-vinyl acetate copolymer. Furthermore, a crosslinking treatment is substantially unnecessary, and adhesiveness and adhesion stability that are appropriate for practical use are obtained.

Sheet for solar cell encapsulant and solar cell module

A solar cell encapsulated with an encapsulating material which is a non-crystalline or low-crystalline &#x3b1;-olefin-based copolymer or its composition (I). The composition (C) can contain 50 to 100 parts by weight of non-crystalline &#x3b1;-olefin polymer (A) which meets the following requirements: (a) the &#x3b1;-olefin having 3 to 20 carbon atoms is not less than 20 mol %, (b) practically no melt peak as measured by a differential scanning calorimeter is observed, and (c) the Mw/Mn is not more than 5, and 50 to 0 parts by weight of crystalline &#x3b1;-olefin polymer (B) (the total of (A) and (B) being 100 parts by weight). The non-crystalline or low-crystalline &#x3b1;-olefin copolymer may also have a crystallinity of not higher than 40% as measured by use of X rays.

Encapsulating material for solar cell

An ethylene copolymer composition which includes a zinc ionomer containing, as a main component, a copolymer having a constituent unit derived from ethylene and a constituent unit derived from (meth)acrylic acid, and a dialkoxysilane having an amino group, is provided. This makes it possible to increase the stability during sheet production. It is preferable that the content ratio of the dialkoxysilane is 15 parts by mass or less based on 100 parts by mass of the zinc ionomer.

Ethylene copolymer composition, sheet for sealing a solar cell element, and solar cell module

The present invention provides a process for producing an encapsulating material for solar cell which makes high-speed crosslinking possible and causes no blister phenomenon without significant restrictions being imposed on the conditions for molding the encapsulating material. The present invention provides a process for producing the encapsulating material for solar cell including impregnating a molded form of an ethylene copolymer with an organic peroxide in a liquid state at normal temperature which shows a decomposition temperature (a temperature at which the half-life period is one hour) of not higher than 150&#xb0; C. A process for producing the encapsulating material for solar cell in which dialkyl peroxide (A) and an organic peroxide (B) selected from peroxycarbonate and peroxyketal at a ratio by weight of 10/90 to 90/10 of (A) and (B) in a liquid state impregnate the molded form of the ethylene copolymer is a preferable embodiment of the present invention.

Process for producing encapsulating material for solar cell

An encapsulating material for solar cell containing a laminated adhesive and heat resistant layer (A) and a buffering layer (B), wherein a difference in flexural modulus between the heat resistant layer (A) and the buffering layer (B) is at least 30 MPa or more, is provided. The adhesive and heat resistant layer (A) is preferably an olefin polymer (a) having a melting point (according to JIS K7121) of 75&#xb0; C. or higher and having a storage elastic modulus at 150&#xb0; C. of 10Pa or more and the buffering layer (B) is preferably an olefin polymer (d) having a stiffness of 100 MPa or less. The encapsulating material for solar cell can provide superior transparency, flexibility, heat resistance and adhesiveness and can remarkably improve production efficiency of a solar cell module even when no organic peroxide is used. The encapsulating material can also exhibit a performance capable of corresponding to the thickness reduction of the solar cell element even when an organic peroxide is used. A solar cell module containing the encapsulating material is also provided.

Growing community of inventors

Ichihara, Japan

Koichi Nishijima