Fujitsu Semiconductor Limited

Socionext Inc.

Koichi Nakamura

Yoshiyuki Yoneda

Ryuji Nomoto

A semiconductor package includes a semiconductor chip, a protruding pillar electrode provided on the semiconductor chip, and resin covering the semiconductor chip and the pillar electrode. The resin has a concave part and exposes a front edge portion of the pillar electrode from the resin at the bottom face of the concave part. The front edge portion of the pillar electrode is exposed from the concave part of the resin, which makes it possible to suppress increase in the height of the pillar electrode and to form the pillar electrodes having fine patterns or a narrow pitch.

Semiconductor device and manufacturing method of the same

Disclosed is a semiconductor device including first and second semiconductor elements, first and second external connection terminals and a sealing member. The first external connection terminal is provided at a first surface of the first semiconductor element. The second semiconductor element is provided at a second surface side, that is at a side opposite to the first surface, of the first semiconductor element. The second external connection terminal is connected to the second semiconductor element, and the second external connection terminal is configured to be, together with the first external connection terminal, connected to a wiring board. The sealing member seals the first and second semiconductor elements and exposes a portion, that is configured to be connected to the wiring board, of the first external connection terminal and a portion, that is configured to be connected to the wiring board, of the second external connection terminal.

Growing community of inventors

Fuchu, Japan

Koichi Nakamura