Lintec Corporation

Kochi University of Technology

Koichi Nagamoto

Kazuhiro Takahashi

Yuta Suzuki

Takeshi Kondo

Kentaro Kusama

Satoshi Naganawa

Yuuta Suzuki

Mikihiro Kashio

Kazuhiro Kon

Tsutomu Hara

Wataru Iwaya

Hitoshi Ohashi

Tadashi Matano

Motoyuki Hayakawa

Kazuyoshi Ebe

Yumiko Amino

Hideo Senoo

Tetsuya Yamamoto

Katsuhiko Horigome

Suguru Kenmochi

Emi Fuchi

Takahiro Yamada

Yasuaki Aso

Eiko Kozukue

Toru Sano

The present invention provides: a gas barrier laminate comprising a base, a primer layer, and a gas barrier layer, the primer layer and the gas barrier layer being sequentially stacked on at least one side of the base, the primer layer having a modulus of elasticity at 90&#xb0; C. of 1.6 GPa or more, and a coefficient of static friction between a surface of one side of the gas barrier laminate and a surface of the other side of the gas barrier laminate being 0.35 to 0.8; a method for producing the gas barrier laminate; an electronic device member comprising the gas barrier laminate; and an electronic device.

Gas barrier laminate, method for producing same, member for electronic devices, and electronic device

The present invention is a long gas barrier laminate including a base, a functional layer, a smoothing layer, and a gas barrier layer,

Elongated gas barrier laminate and method for producing same

The present invention is a gas barrier laminate comprising a base and a gas barrier unit, the gas barrier unit comprising at least two inorganic layers, at least one of the at least two inorganic layers being a silicon oxynitride layer, the silicon oxynitride layer including a composition-gradient region that has a thickness of 25 nm or more, the composition-gradient region being a region in which a content ratio of oxygen decreases and a content ratio of nitrogen increases in a thickness direction toward the base, and a ratio of the thickness of the composition-gradient region to the thickness of the entire silicon oxynitride layer being 0.15 or more. The present invention also relates to: an electronic device member that includes the gas barrier laminate, and an electronic device that includes the electronic device member. The present invention provides: a gas barrier laminate that exhibits a very high gas barrier capability and very high bendability, an electronic device member that includes the gas barrier laminate, and an electronic device that includes the electronic device member.

Gas barrier laminate, member for electronic device, and electronic device

Provided are a conductive film which is excellent in hygrothermal characteristics and has excellent bending performance, and an electronic device having such a conductive film. A conductive film is obtained by forming, on one surface or both surfaces of a substrate, a zinc tin oxide (ZTO) layer and a transparent conductive film that is formed of zinc oxide other than zinc tin oxide sequentially from the substrate side, in which a thickness of the zinc tin oxide layer is 5 to 500 nm, a thickness of the zinc oxide-based transparent conductive film is 5 to 1000 nm, and a water-vapor transmittance rate of the zinc tin oxide (ZTO) layer is 0.1 g/(m&#xb7;day) or less.

Conductive film and electronic device having conductive film

The present invention is a transparent conductive laminate comprising a base, a low-refractive-index layer, an intermediate-refractive-index layer, and a transparent conductive layer, the low-refractive-index layer, the intermediate-refractive-index layer, and the transparent conductive layer being sequentially stacked on at least one side of the base either directly or through one or more layers, the low-refractive-index layer having a refractive index of 1.40 to 1.50, and the intermediate-refractive-index layer having a refractive index of 1.50 to 1.80 and a film density of 2.5 to 4.5 g/cm. The present invention provides a transparent conductive laminate that exhibits excellent moisture-heat resistance and excellent optical properties, and an electronic device or module.

Transparent conductive laminate and electronic device or module

Provided is a gas barrier pressure-sensitive adhesive sheet having at least one gas barrier layer and at least one pressure-sensitive adhesive layer, the at least one pressure-sensitive adhesive layer having a storage modulus at 23&#xb0; C. of 1.5&#xd7;10to 1.0&#xd7;10Pa, and the gas barrier pressure-sensitive adhesive sheet not including a base layer. Also, provided is the following: a gas barrier pressure-sensitive adhesive sheet that makes it possible to easily provide the adherend with a gas barrier capability without significantly increasing the thickness of the gas barrier pressure-sensitive adhesive sheet, does not show delamination (separation) at the interface between the pressure-sensitive adhesive layer and another layer even when subjected to high-temperature/high-humidity conditions, and exhibits excellent bendability, a method for producing the same, an electronic member that includes the gas barrier pressure-sensitive adhesive sheet, and an optical member that includes the gas barrier pressure-sensitive adhesive sheet.

Gas barrier adhesive sheet, method for producing same, electronic member, and optical member

A zinc-oxide-based conductive stacked structureincludes a substrateand, formed on at least one surface of the substrate, an undercoat layerand a transparent conductive film. The transparent conductive film is formed of a plurality of transparent conductive layers formed from a zinc-oxide-based conductive material and has a carrier density of 2.0&#xd7;10to 9.8&#xd7;10cm. The zinc-oxide-based conductive stacked structure exhibits a change ratio in sheet resistivity of 50 or less, after bending of the stacked structure around a round bar having a diameter of 15 mm, with the transparent conductive film facing inward.

Zinc oxide-based conductive multilayer structure, process for producing the same, and electronic device

Provided is a pressure-sensitive adhesive for polarizing plates which can adhere a polarizing plate on a liquid crystal cell with good adhesion durability and has the characteristic that a liquid crystal display device obtained therefrom is less liable to cause light leakage even under the environment of high temperature and high humidity and which makes it possible remove the polarizing plate. The pressure-sensitive adhesive for polarizing plates is prepared by irradiating a pressure-sensitive adhesive material comprising (A) an acrylic base polymer having a weight average molecular weight of 1,000,000 or more comprising a monomer having a hydroxyl group in a monomer composition ratio of 10 mass % or less, (B) an acrylic base polymer having a weight average molecular weight of 1,000,000 or more comprising a monomer having a carboxyl group in a monomer composition ratio of 10 mass % or less and (C) an active energy beam-curable compound with an active energy beam, wherein a mass ratio of the component (A) to the component (B) is 100:1 to 100:50, and a storage elastic modulus (G') at 23&#xb0; C. is 0.3 MPa or more.

Pressure-sensitive adhesive for polarizing plates, pressure-sensitive adhesive sheet, polarizing plate with pressure-sensitive adhesive and production process for the same and optical film and production process for the same

Provided are a pressure-sensitive adhesive for polarizing plates which can apply a polarizing plate on a liquid crystal cell with good adhesion and has the characteristic that a liquid crystal display device obtained therefrom is less liable to cause light leakage even under the environment of high temperature and high humidity and which has a removability and a polarizing plate with the above pressure-sensitive adhesive and a production process for the same. The pressure-sensitive adhesive for polarizing plates is prepared by irradiating a pressure-sensitive adhesive material comprising (A) an acrylic base polymer comprising a monomer having a carboxyl group in a monomer composition ratio of 0.5 mass % or less and (B) an active energy beam-curable compound with an active energy beam and it has a storage elastic modulus (G') of 0.3 MPa or more at 23&#xb0; C.

Pressure-sensitive adhesive for polarizing plates, polarizing plate with pressure-sensitive adhesive and production process for the same

A pressure-sensitive adhesive containing a pressure-sensitive adhesive resin and fine particles having an average particle diameter of 0.1 to 20 &#x3bc;m. The pressure-sensitive adhesive has a storage elastic modulus (G') at 23&#xb0; C. of 0.3 to 15 MPa, and a haze value that is 5% or more.

Pressure-sensitive adhesive for applying optically functional film, optically functional film and production process for the same

The disclosed a pressure sensitive adhesive for polarizing plates which has a storage elastic modulus (G') at 23&#xb0; C. of at least 0.3 MPa; a polarizing plate having a pressure sensitive adhesive; a process for producing the above polarizing plate which comprises sticking a polarizing plate on a tacky adhesive material layer formed on a releasing layer of a releasing sheet, and thereafter irradiating with an active energy beam from the releasing sheet side; an optical film which comprises a polarizing plate and a phase difference plate; and a process for producing the above optical film. The pressure sensitive adhesive and polarizing plate having the pressure sensitive adhesive are characterized in that they are capable of sticking with high durability, the polarizing plate to a and phase difference plate, and the resultant liquid crystal display unit is less liable to cause light leakage under the conditions of high temperature.

Pressure sensitive adhesive for polarizing plates, polarizing plate with pressure sensitive adhesive and production process for polarizing plate

Provided is a pressure-sensitive adhesive for an optically functional film which can carry out adhesion with a good durability in adhesion of an optically functional film such as adhesion of a polarizing plate, particularly a polarizing plate integrated with a viewing angle expanding film and the like with a liquid crystal cell, adhesion of a polarizing plate with a retardation film, adhesion of a retardation film with a retardation film and adhesion of a retardation film with a liquid crystal cell and which has the characteristics that a liquid crystal display obtained therefrom is less liable to cause light leakage even under the environment of high temperature and high humidity and that static electricity is less liable to be produced when peeling off a release film from a pressure-sensitive adhesive layer. The pressure-sensitive adhesive for applying an optically functional film comprises a pressure-sensitive adhesive resin and an antistatic agent, wherein a storage elastic modulus (G') at 23&#xb0; C. is 0.3 MPa or more, and a charged voltage on the surface of a layer comprising the above pressure-sensitive adhesive which is measured 5 seconds later since peeling off a release film brought into contact with the above pressure-sensitive adhesive layer under the environment of 23&#xb0; C. and a relative humidity of 50% is 1.0 kV or less.

It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and fouling of a wafer even when a wafer having high bumps which are highly densely arranged is ground to an extremely small thickness, and besides, no adhesive is left at the roots of the bumps after the surface protective sheet is peeled. The surface protective sheet of the invention is used for grinding a back surface of a semiconductor wafer, and in the surface protective sheet, one surface of a base sheet is provided with an opening portion having a diameter smaller than an outer diameter of a semiconductor wafer to be stuck, on said opening portion no adhesive layer being formed, and a portion which is provided around the opening portion and on which an adhesive layer is formed.

Surface-protecting sheet and semiconductor wafer lapping method

A semiconductor wafer protection structure including a semiconductor wafer and a protective sheet overlaid on a circuit surface of the semiconductor wafer, wherein the protective sheet has a larger diameter than the outer diameter of the semiconductor wafer. Semiconductor wafer protection structures and methods, and laminated protective sheet for use therein are provided and enable prevention of damage to a wafer during grinding and transportation when the wafer is ground to an ultrathin thickness and transported. Also provided is a process for processing a semiconductor wafer whereby damage to the wafer can be reduced during application and cutting of an adhesive sheet.

Semiconductor wafer protection structure and laminated protective sheet for use therein

Disclosed herein is a pressure sensitive adhesive sheet for fixing a semiconductor wafer during semiconductor wafer processing in vacuum, comprising a substrate and, superimposed on one side or both sides thereof, a layer of ultraviolet curable pressure sensitive adhesive composition comprising an ultraviolet curable copolymer having ultraviolet polymerizable groups as side chains and a phosphorous photopolymerization initiator. The pressure sensitive adhesive sheet for semiconductor wafer processing, even in the processing of a semiconductor wafer in vacuum, is free from generating gases from the pressure sensitive adhesive sheet, thereby avoiding wafer deformation attributed to evaporated gas components and adhesive transfer caused thereby.

Growing community of inventors

Tokyo, Japan

Koichi Nagamoto