Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Osaka Gas Chemicals Co., Ltd.

Koichi Morita

Shozo Minamitani

Kenichi Nishino

Naoto Hosotani

Syunji Onobori

Yoshiyuki Ozaki

Shunji Onobori

Hiroyuki Fujimoto

Kazuhiro Ota

A heating and pressurizing apparatus (), to which a circuit board () with electronic components () pre-bonded thereto via bonding elements () is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member () having a heating device (). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

In a high power output non-aqueous electrolyte secondary battery including a negative electrode including a graphitizable carbon material, the physical properties of the graphitizable carbon material is controlled. In a X-ray diffraction pattern of the graphitizable carbon material, a ratio of a peak intensity I(101) attributed to a (101) plane to a peak intensity I(100) attributed to a (100) plane satisfies 0&#x3c;I(101)/I(100)&#x3c;1.0. A ratio of a peak intensity I(110) attributed to a (110) plane to a peak intensity I(004) attributed to a (004) plane satisfies 0.7&#x2266;I(110)/I(004) &#x2266;1.4. The graphitizable carbon material preferably has a specific surface area measured by BET method of 1 to 5 m/g.

High power output non-aqueous electrolyte secondary battery

A heating and pressurizing apparatus ( ), to which a circuit board ( ) with electronic components ( ) pre-bonded thereto via bonding elements ( ) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member ( ) having a heating device ( ). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

A component mounting apparatus includes a component holding and conveying device for holding and conveying a component and mounting the component onto a circuit board, a circuit board holding device for holding the circuit board, an image recognition optical system for performing recognition of the component and the circuit board with different fields of view, respectively, and a control section. The control section repeatedly determines an optical axis shift amount with the two fields of view between a position of the component and a position of the circuit board recognized by the image recognition optical system. Based on these determination results, the control section determines an optical axis shift amount for calibration, wherein calibration of the image recognition optical system is performed based on the optical-axis shift amount for calibration determined by the control section. Then, the component is mounted onto the circuit board.

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Schaumburg, IL, United States of America

Koichi Morita