Dsm IP Assets B.v.

Toppan Printing Co., Ltd.

Yazaki Corporation

Koichi Kumai

Ryuji Ueda

Takehito Tsukamoto

Minoru Kawasaki

Takao Tomono

Shigeki Kudo

Kentaro Kubota

Daisuke Miyakawa

Takao Minato

Masayuki Ode

Shigeru Hirayama

Ryohei Gorai

A solid-state imaging device including a substrate having a surface, microlenses formed on the surface, and a concave lens formed between adjacent ones of the microlenses and having a concave shape directed toward the surface of the substrate.

Solid-state imaging device including microlenses on a substrate and method of manufacturing the same

A metal foil pattern layered body of the invention includes a base member; a metal foil including a metal pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Method of manufacturing a circuit board by punching

A metal foil pattern layered body of the invention includes: a base member; a metal foil including a metal foil pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

In a manufacturing method of an aluminum wire crimp terminal formed by a base material made of a copper-based metal, at the step of forming an intermediate worked material having an unfolded shape of the crimp terminal, fine recessed parts for promoting the adhesive performance of the crimp terminal against a conductor of the wire are formed on a plate-body surface forming an inner face of a conductor crimping part of the intermediate worked material. Subsequently, a thin-film surface layer made of an aluminum-based metal is formed on at least the plate-body surface. Finally, the intermediate worked material is bent to a prescribed terminal shape.

Crimp terminal having a conductor crimping part with an intermediate material with recessed parts and a thin-film layer on its top

A first clad layer is formed on a smooth support substrate via a release layer. On the first clad layer, a core through which light propagates and alignment marks are simultaneously formed. Further, these layers are covered with a second clad to obtain an optical wiring layer. Then, the optical wiring layer is released from the support substrate and stuck to a substrate having an electric wiring. Subsequently, on the resulting substrate are formed a mirror for reflecting light propagating through the core, pads for installing optical parts or the like, and via holes for electrically connecting the electric wiring on the substrate to the pads. For this formation, the alignment marks are used as references.

Growing community of inventors

Tokyo, Japan

Koichi Kumai