Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Koichi Kotera

Hiroyoshi Tanaka

Akira Shiokawa

Hideaki Yasui

Masaki Aoki

Ryuichi Murai

Shigeo Suzuki

Mitsuhiro Ohtani

Yoshiki Sasaki

Masatoshi Kudoh

Isamu Inoue

Kinzou Nonomura

Masao Uchida

Takeo Ohta

Kanako Miyashita

Yoshinao Ooe

Osamu Watanabe

Hiroyosi Tanaka

Hiroki Kono

Koji Akiyama

Hidetaka Higashino

Takashi Hirao

Masami Uchida

Katsutoshi Shindo

Yuuji Mukai

Tetsuya Imai

Kiyohiko Kitagawa

Osamu Matsunaga

Takayuki Taguchi

Kunihiro Matsubara

Disclosed are an electron emission thin-film with improved secondary electron emission characteristics compared with conventional ones, a plasma display panel including the electron emission thin-film, and their manufacturing methods. Using a vacuum deposition system, a protective layer that is an MgO thin-film is formed on a dielectric layer formed on a front glass substrate. At the time of deposition, angles that lines linking the central point of a target material for the protective layer respectively with the central point and both ends points of the front glass substrate form with the front glass substrate are exclusively in a range of 30 to 80&#xb0;. This enables at least some of MgO columnar crystals constituting the protective layer to have flat planes that are inclined with respect to the surface of the thin-film.

Electron emission thin-film, plasma display panel and methods for manufacturing

A plasma display panel having excellent electron emission properties and a method of making the same. A plasma display panel is provided with a protective layer having a dense growth of columnar crystals formed on a dielectric layer. A middle layer can be provided for improving orientation of the columnar crystals. A heating step creates seed crystals to increase the width and growth of columnar crystals with a selective orientation and greater diameter. The area of any exposed surfaces on the protective layer becomes smaller and absorption of impurities decreases. A layer of grain crystals or an amorphic crystal layer is initially deposited on the dielectric layer to establish wider area seed crystals of a desired orientation. A vacuum evaporated complimentary protective layer can then be grown with the improved configuration.

Plasma display panel and production method thereof and plasma display panel display unit

A gas discharge panel capable of high-speed driving at a low drive voltage, while suppressing the occurrence of write errors in a write period, and a manufacturing method for the same. To achieve this, in the gas discharge panel of the present invention, a secondary gas formed from at least one of carbon dioxide, water vapor, oxygen and nitrogen is induced into discharge spacesevacuated until the residual gas pressure is 0.02 mPa or less, and an He&#x2014;Xe or Ne&#x2014;Xe rare gas (discharge gas) is induced into discharge spaces. The amount of the secondary gas included within discharge spaceswhen, for example, carbon dioxide is included therein, is suitably set in terms of both a discharge starting voltage and an electron emission ability, so that the partial pressure of the carbon dioxide is in a range of 0.05 mPa to 0.5 mPa inclusive.

Gas discharge panel and manufacturing method for the same

An electron emission thin-film with improved secondary electron emission characteristics compared with conventional ones, a plasma display panel including the electron emission thin-film, and their manufacturing methods. Using a vacuum deposition system, a protective layer that is an MgO thin-film is formed on a dielectric layer formed on a front glass substrate. At the time of deposition, angles that lines linking the central point of a target material for the protective layer respectively with the central point and both ends points of the front glass substrate form with the front glass substrate are exclusively in a range of 30 to 80 &#xb0;. This enables at least some of MgO columnar crystals constituting the protective layer to have flat planes that are inclined with respect to the surface of the thinfilm.

Electron emission thin-film, plasma display panel comprising it and method of manufacturing them

A PDP does not suffer from dielectric breakdown even though a dielectric layer is thin, with the problems of conventional PDPs, such as cracks appearing in the glass substrates during the production of the PDP being avoided. To do so, the surface of silver electrodes of the PDP is coated with a 0.1-10 &mgr;m layer of a metallic oxide, on whose surface OH groups exist, such as ZnO, ZrO , MgO, TiO , Al O , and Cr O . The metallic oxide layer is then coated with the dielectric layer. It is preferable to form the metallic oxide layer with the CVD method. The surface of a metallic electrode can be coated with a metallic oxide, which is then coated with a dielectric layer. The dielectric layer can be made of a metallic oxide with a vacuum process method or the plasma thermal spraying method. The dielectric layer formed on electrodes with the CVD method is remarkably thin and flawless. When the dielectric layer is formed with the vacuum process method or the plasma spraying method, warping and cracks conventionally caused by baking the dielectric layer are prevented. Here, borosilicate glass including 6.5% or less by weight of alkali can be used as the glass substrate.

Plasma display panel suitable for high-quality display and production method

There is provided a plastic base material having a reformed layer formed on a plastic substrate by reforming the surface layer thereof into a component containing fluorine at the ratio of the number of fluorine atoms to the number of carbon atoms, F/C, of 0.85 or more and 1.30 or less, and having highly durable water repellency and ink repellency. The method of manufacturing such a plastic base material comprises a step of reforming the surface of the plastic substrate into a fluorine-containing carbon layer by imparting a specific energy to fluorine-containing plasma by applying an RF bias voltage to the plastic substrate to form a surface having highly durable water repellency and ink repellency. A highly durable ink-jet printer that enables high-quality printing can be provided by the use of a head for an ink-jet printer fabricated by using this plastic base material.

Plastic base material and method for the manufacture thereof; and head for ink-jet printer and method for the manufacture thereof

A PDP does not suffer from dielectric breakdown though a dielectric layer is thin, with the problems of conventional PDPs, such as cracks appearing in the glass substrates during the production of the PDP being avoided. To do so, the surface of silver electrodes of the PDP is coated with a 0.1-10 &mgr;m layer of a metallic oxide, on whose surface OH groups exist, such as ZnO, ZrO , MgO, TiO , Al O , and Cr O . The metallic oxide layer is then coated with the dielectric layer. It is preferable to form the metallic oxide layer with the CVD method. The surface of a metallic electrode can be coated with a metallic oxide, which is then coated with a dielectric layer. The dielectric layer can be made of a metallic oxide with a vacuum process method or the plasma thermal spraying method. The dielectric layer formed on electrodes with the CVD method is remarkably thin and flawless. When the dielectric layer is formed with the vacuum process method or the plasma spraying method, warping and cracks conventionally caused by baking the dielectric layer are prevented. Here, borosilicate glass including 6.5% or less by weight of alkali can be used as the glass substrate.

There is provided a plastic base material having a reformed layer,formed on a plastic substrate,by reforming the surface layer thereof into a component containing fluorine at the ratio of the number of fluorine atoms to the number of carbon atoms, F/C, of 0.85 or more and 1.30 or less, and having highly durable water repellency and ink repellency. The method of manufacturing such a plastic base material comprises a step of reforming the surface of the plastic substrate,into a fluorine-containing carbon layer by imparting a specific energy to fluorine-containing plasma by applying an RF bias voltage to the plastic substrate,to form a surface having highly durable water repellency and ink repellency. A highly durable ink-jet printer that enables high-quality printing can be provided by the use of a head for an ink-jet printer fabricated by using this plastic base material.

Plastic substrate and method of manufacturing the same, and ink jet printer head and method of manufacturing the same

A PDP does not suffer from dielectric breakdown even though a dielectric layer is thin, with the problems of conventional PDPs, such as cracks appearing in the glass substrates during the production of the PDP being avoided. To do so, the surface of silver electrodes of the PDP is coated with a 0.1-10 .mu.m layer of a metallic oxide on whose surface OH groups exist, such as ZnO, ZrO.sub.2, MgO, TiO.sub.2, Al.sub.2 O.sub.3, and Cr.sub.2 O.sub.3. The metallic oxide layer is then coated with the dielectric layer. It is preferable to form the metallic oxide layer with the CVD method. The surface of a metallic electrode can be coated with a metallic oxide, which is than coated with a dielectric layer. The dielectric layer can be made of a metallic oxide with a vacuum process method or the plasma thermal spraying method. The dielectric layer formed on electrodes with the CVD method is remarkably thin and flawless. When the dielectric layer is formed with the vacuum process method or the plasma spraying method, warping and cracks conventionally caused by baking the dielectric layer are prevented. Here, borosilicate glass including 6.5% or less by weight of alkali can be used as the glass substrate.

Plasma display panel with metal oxide layer on electrode

To cope with recent LCD or PDP of larger size, an efficient transfer technology is demanded in manufacturing a larger substrate. It calls for a transfer method for such larger substrate with a less required space, and a substrate transfer cassette enabling such method. A technology is disclosed, which comprises a substrate transfer cassette (50) containing a plurality of substrates, a dolly (55) for loading the substrate transfer cassette (50), and a plurality of cassette holders (70) having a rotating arm (71) which can rotate in the vertical direction, wherein a substrate cassette (50) is transferred from a position near another cassette holder to a position near a destination cassette holder with the dolly (55), raised by the rotating arm (71) on the destination cassette holder (70) from the lower section to the upper section of the dolly (55), and moved from the dolly (55) to the cassette holder (70).

Substrate transfer method and substrate transfer cassette

An electron emission cathode includes: an n-type semiconductor film including diamond particles partially projecting from a surface of the n-type semiconductor film; and an anode opposing the n-type semiconductor film with a vacuum interposed therebetween. Electrons are emitted by applying a voltage between the anode and the n-type semiconductor film.

Electron emission cathode; an electron emission device, a flat display,

Electron emission cathode having a semiconductor film; a device

A beam emitted from a light source including the characteristic wavelength of flown particles in a film forming system is interrupted by a beam chopper in a predetermined cycle, and is then divided into a probing beam and a reference beam by a beam divider. The probing beam passes through a particle flight area and is then injected into a photo detector through an optical filter, and a probing signal is outputted. A reference signal is obtained from the reference beam in the same manner. A data processor detects the phase and level of both signals, so that an absorbance, i.e., a film forming rate for the flown particles is estimated. The film forming rate is integrated with time so that a film thickness is estimated. Thus, the range of the applicable film forming rate is wide. In addition, it is possible to perform continuous monitoring with high precision also in an atmosphere where a large amount of light having the same wavelength as the characteristic wavelength of the flown particles is generated, as in sputtering systems.

In-process film thickness monitoring system

Optical information recording medium

Proposed is a method for manufacturing an optical memory disc having a pregrooved substrate and a recording film on the pregrooved substrate. In the step of depositing the recording film on the pregrooved substrate, light is incident on the pregrooved substrate, and at least one of exposure amounts of light reflected by and light transmitted through the pregrooved substrate and the recording film while the recording film is being deposited on the pregrooved substrate is measured. When one of the exposure amounts of light reflected by and light transmitted through the pregrooved substrate and the recording film has reached the corresponding preset exposure amount, the deposition of the recording film is stopped.

Growing community of inventors

Osaka, Japan

Koichi Kotera