Nuvoton Technology Corporation Japan

Matsushita Electric Industrial Co., Ltd.

Koichi Kawashima

Tokuhiko Tamaki

Koji Katayama

Yukio Hayakawa

Kazunari Homma

Atsushi Himeno

Shinichi Yoneda

Satoru Ito

Kenji Tateiwa

Yasuo Sakurai

Ryutaro Yasuhara

In a non-volatile storage device, a first lower-layer metal wire, a lower plug, a variable resistance element, an upper plug, and a first upper-layer metal wire are formed in that order from below in a storage region, and a second lower-layer metal wire, a first via, a middle-layer metal wire, a second via, and a second upper-layer metal wire are formed in that order from below in a circuit region. The first and second lower-layer metal wires are formed in the same layer, and the first and second upper-layer metal wires are formed on the same layer. Relative to a substrate, the variable resistance element and the middle-layer metal wire have top faces at different heights, bottom faces at different heights, or both top faces and bottom faces at different heights.

Non-volatile storage device and method of manufacturing the same

A gas sensor includes a gas detecting element that includes a first electrode, a metal oxide layer, and a second electrode; and a first insulating film that has an opening allowing the second electrode to be partially exposed therethrough and covers the first electrode, the metal oxide layer, and another part of the second electrode. The metal oxide layer has a characteristic where its resistance value changes as the second electrode makes contact with gas molecules including hydrogen atoms. A first step is provided at a portion lying on an interface between the metal oxide layer and the second electrode and located within the opening as viewed in plan view. A local region is provided in the metal oxide layer and near the first step. A degree of oxygen deficiency of the local region is greater than a degree of oxygen deficiency of other regions in the metal oxide layer.

Gas sensor, method of manufacturing gas sensor, and fuel cell vehicle

Variations in the size of a linear pattern resulting from difference in mask pattern layout are prevented by setting the perimeter of the linear pattern per unit area in a specified range irrespective of the type of a semiconductor integrated circuit device or by adjusting a process condition in accordance with type-to-type difference in the perimeter of the linear pattern per unit area.

Semiconductor integrated circuit device and method for fabricating the same

Growing community of inventors

Kyoto, Japan

Koichi Kawashima