Matsushita Electric Industrial Co., Ltd.

Koichi Kanematsu

Kenichi Sato

Yasuhiro Okada

Hiroaki Fujiwara

Satoshi Masuda

Osamu Yamazaki

Makoto Kawai

Setsuo Horimoto

Yoshifumi Nakao

Kenichi Satou

A system for assisting in management of a packaging plant, according to which such information as on packaging cost, machine characteristics and surface packaging method is transformed into database, whereby the packaging cost calculation, production capacity calculation, line arrangement method, packaging method, and packaging arrangement investigation method are translated into numeral equations or software. With this system, highly accurate investigation results can be output in a short time period, thereby assisting in making an optimum management decision.

System for assisting in management of packaging plant

A production system for mounting components on circuit boards includes a solder printing unit having a solder printing device for printing solder onto lands of a circuit board and a solder printing inspecting device for inspecting a printing state the solder, a component mounting unit having a component mounting device for mounting a component to a predetermined position of the printed solder on the circuit board and a component mounting inspecting device for inspecting a mounting state of the component, and a soldering unit having a soldering device for melting and hardening the printed solder and a soldering inspecting device for inspecting a soldering state of the soldering. The system further includes a data memory, a first information data input device for inputting into the data memory first data related to each of the devices in the printing unit, component mounting unit, and soldering unit, and a second information data input device for inputting into the data memory second data related results of countermeasures executed based on the inputted first data of the three inspecting devices. The system still further includes a correlation analyzing part which combines corresponding items of the first and second data stored in the data memory and analyzes a frequency of each item, thereby generating rules which to predict or estimate a result from a cause, a cause from a result, and a result from a maintenance work among the first data, second data, and maintenance works.

Component-mounted circuit board production system

An assembly line includes a printing device for printing solder on a land of a circuit board, a mounting device for mounting an electric component at a predetermined position of the solder, and a soldering device for soldering the land to a terminal of the component. A monitored items detecting device detects predetermined to be monitored items of the board and equipment used in the printing, mounting, or soldering devices, and a control device analyzes a condition of the equipment and quality of the board with reference to warning criterion which do not exceed failure criterion, and then dynamically controls the various devices accordingly.

Producing system of printed circuit board and method therefor

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Hirakata, Japan

Koichi Kanematsu