Hitachi High-tech Instruments Company, Ltd.

Koichi Izuhara

Kazuyoshi Oyama

Masami Iizuka

Hisayoshi Kashitani

Yutaka Mitsumochi

Yoshihiro Onoguchi

Hiroomi Kobayashi

Takahiro Nakano

Ken Igarashi

Manabu Okamoto

Takafumi Chida

Haruhiko Yamaguchi

Yoshiyuki Tsujimoto

Attila Lengyel

The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement parthaving the multiple placement heads simultaneously pick up the components from the palletand simultaneously place the components on the circuit board, the controllerspecifies a pair of component groups to be picked up simultaneously from the palletby the multiple placement heads and places the components on the circuit board, so that an area where the multiple placement heads move in overlapping manner is minimized, and the placement heads respectively pick up the components included in the pair of component groups being specified and place the components on the circuit board.

Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method

The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.

Electronic component mounting apparatus

Technology is provided for changing a mounting angle of a component to reduce the amount of relative displacement between a mounting head and a board. A component, for which a mounting angle can be changed, is specified based on information stored in a mounting data storage area and a component data storage area according to a predetermined component mounting order. A mounting time in a mounting path with the mounting angle of the specified component being changed is calculated for each mounting angle to specify the mounting path requiring the shortest mounting time.

Setting device, component mounting system, program and calculating method

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Ooizumi, Japan

Koichi Izuhara