Nippon Steel Chemical Co., Ltd.

Nippon Steel Corporation

Unitika Ltd.

Koichi Fujishiro

Shuichi Mitamura

Shinji Inaba

Kazuhiro Watanabe

Takero Teramoto

Masao Kimura

Kazuhiko Mizuuchi

Hiroshi Ohishi

Takumi Tanaka

Masanao Kawabe

Masaya Furukawa

Hiroharu Inoue

Souichiro Kishimoto

Keizo Kyuda

Akio Motoyama

Yasuhisa Tsutsumi

Fumihiro Ohmori

Yoshimi Kata

Koji Nakamura

Takamasa Owaki

Hiroshi Ogata

Manabu Higashi

This invention relates to an insulating resin composition which exhibits high impact resistance and heat resistance and good adhesiveness to the plating metal, is selectively etchable by a permanganate salt commonly used in a plating operation and suited for an insulating layer in multilayer wiring boards. The insulating resin composition is a photo-polymerizable or thermally polymerizable resin composition comprising 3-10 parts by weight of a crosslinked elastic polymer per 100 parts by weight of a resin component (excluding the crosslinked elastic poly and including monomers) and said crosslinked elastic polymer has carboxyl groups and is dispersed with an average secondary particle diameter in the range of 0.5-2 &mgr;m.

Insulating resin composition and laminate obtained therefrom

Composition of aromatic polyepisulfide,polyglycidyl ether and/or ester, and acid anhydride

This invention relates to a photopolymerizable resin composition containing resin component (A) composed of a resin and/or a resin-forming ingredient and a photopolymerization initiator (B) wherein the component (A) comprises an addition-polymerizable compound (A1) having at least two ethylenically unsaturated groups and the photopolymerization initiator (B) comprises a diaminobenzophenone compound (B1), an N-phenylglycine compound (B2), and at least one kind of compound selected from a group of a 3,3&prime;,4,4&prime;-tetra(alkylperoxycarbonyl)benzophenone (B3), 2-methyl-1-&lsqb;4-(thiomethyl)phenyl&rsqb;- 2-morpholinopropan-1-one (B4), and a 1,3,5-triazine derivative (B5) containing at least one trihalomethyl group as substituent. A photopolymerizable resin composition of this invention excels in resolution, adhesion of patterns, development latitude, and curing on the surface and inside and can be used advantageously in insulating films, colored films, inks for color filters, resists for semiconductors, and insulating spacers for touch panels.

Photopolymerizable resin compositions and use thereof

Ortho spiroesters and curable and cured resin compositions of same

A process is disclosed for preparing of aromatic polyester-polystyrene block copolymers which comprises subjecting preferentially styrene polymers (A) having terminal functional groups reactive with acid chloride groups and an excess of aromatic dicarboxylic acid dihalides (C) to condensation and then subjecting continuously the resultant mixture and aromatic dihydroxy compounds (B) to interfacial polymerization at the ratio (A)/[(B)+(C)] by weight of 5/95 to 80/20, without separating reaction products of styrene polymers (A) and aromatic dicarboxylic acid dihalides (C), and the block copolymers thus prepared contain a small amount of uncopolymerized styrene polymers, have long aromatic polyester segments, show low birefringence, good transparency, exceptionally low birefringence, low melt viscosity, and good mechanical strength, and are particularly useful as materials for optical instruments.

Process for preparing aromatic polyester-polystyrene block copolymers

A process for the preparation of aromatic carboxylic acids or their salts comprises heating carboxyl-free aromatic compounds and aromatic carboxylic acid salts whose basic structures differ from those of the aromatic compounds, or heating polycyclic aromatic compounds with three or more rings and monocyclic or bicyclic aromatic carboxylic acid salts, under carbon dioxide pressure in the presence of one or more metal compounds selected from group (a) of compounds of zinc, cadmium, and thallium and one or more compounds selected from group (b) of compounds of cesium, Group II metals, And Group IIIa metals to effect the intermolecular transfer of the carboxyl groups.

Process for the preparation of aromatic carboxylic acids

Disclosed is a process for the preparation of a naphthalene-2,6-dicarboxylic acid dialkali metal salt which comprises heating an alkali metal salt of naphthoic acid and/or a dialkali metal salt of naphthalene-dicarboxylic acid under pressure with carbon dioxide gas in the presence of a catalyst, wherein an aprotic polycyclic aromatic compound having 2 or 3 rings is used as a reaction medium. Naphthalene-2,6-dicarboxylic acid dialkali metal salt can be obtained in high yield and selectivity with a good reproducibility of the reaction.

Process for preparation of naphthalene-2,6-dicarboxylic acid dialkali

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Tokyo, Japan

Koichi Fujishiro