Toray Industries, Inc.

Koichi Fujimaru

Toshihisa Nonaka

Takejiro Inoue

Kazuki Goto

Norimasa Ikeda

Ken Kawamura

Yoichi Shinba

Michihiko Ichikawa

Hiroyuki Niwa

Kazuyuki Matsumura

Nobuo Matsumura

Hironobu Sadakuni

Yuichi Tsuji

Daisuke Kanamori

Yoichi Shimba

Yoshiko Tatsuta

Noboru Koshimizu

Toshio Yoshimura

The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

Adhesive composition, semiconductor device containing cured product thereof, and method for manufacturing semiconductor device using same

The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.

Adhesive agent having a polyimide and acid modified rosin

An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25&#xb0; C. under 1.013&#xd7;10N/mand a compound being solid at 25&#xb0; C. under 1.013&#xd7;10N/m, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.

Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device

The present invention is an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

Paste composition for light guide and light guide utilizing the same

A resin composition has a phase separation structure having at least two phases and inorganic particles having a mean primary particle size of 0.1 &mgr;m or less. The phase separation structure includes a matrix phase and a disperse phase. The inorganic particles are mainly present in any one of the matrix phase, the disperse phase, and the interface between the matrix phase and the disperse phase. The resin composition has a high thermal expansion coefficient and elastic modulus, and thus provides an adhesive for semiconductor devices which has excellent reflow resistance and adhesion.

Resin composition, adhesive film for semiconductor device, and laminated film with metallic foil and semiconductor device using the same

A directly imageable waterless planographic printing plate precursor is a laminate of, in turn, at least a heat sensitive layer and a silicon rubber layer on a substrate. The heat sensitive layer includes (A) a light-to-heat converting material and (B) a compound which contains N&mdash;N bonds.

Directly imageable waterless planographic printing plate

Growing community of inventors

Otsu, Japan

Koichi Fujimaru