Fuji Machine Mfg. Co., Ltd.

Mitsubishi Denki Kabushiki Kaisha

Fuji Mfg. Co. Ltd.

Other

Fuji Machine Manufacturing Company, Limited

Kel Corporation

Meiwa Inc.

Fuji Mgf. Co., Ltd.

Fugi Mfg. Co., Ltd.

Fuji Machine Co., Ltd.

Fuji Machine Mgf. Co., Ltd.

Koichi Asai

Shinsuke Suhara

Yasuo Muto

Mamoru Tsuda

Kunio Oe

Takeyoshi Isogai

Yukinori Takada

Jun Adachi

Tousuke Kawada

Kunio Ooe

Manabu Mizuno

Masayuki Shimmura

Tohsuke Kawada

Yoshiyuki Iwaki

Seigo Kodama

Kazuya Suzuki

Jiro Kodama

Sinsuke Suhara

Ryozo Kuroda

Koso Matsumoto

Yoshifusa Hyodo

Hiroyasu Ohashi

Seiichi Terui

Kazuaki Mori

Kazutoshi Sakai

Mitsuo Morishita

Kazufumi Suga

Hirokazu Ikegami

Mamoru Tuda

Kazuo Amano

Tomohiko Hattori

Yoshiyuki Kondo

Mitsuho Tanaka

Tokiyuki Kuno

Toshikatsu Terashima

Yasunori Kamegai

Takehisa Ishikawa

Tetsunori Kawasumi

Shunji Yoshikane

Masakazu Koiso

Yasumoto Shioya

Ye JianMing

Yukio Ueno

Toshimitsu Oka

Kazuhiko Yokomae

Tomoyuki Sawa

Hiroshi Oono

Hironobu Ichikawa

Nobuyuki Teshi

A method of fabricating a photovoltaic panel is disclosed which is formed by arranging a number of granular photovoltaic devices in an array and forming the array into the shape of a panel from a transparent resin and includes each photovoltaic device having a part protruding from the resin. The method includes filling an escape recess of a receiver with a plastic sealing material, setting a forming die on the receiver, accommodating the photovoltaic devices in bowl-shaped recesses of the forming die respectively, pressing the photovoltaic devices accommodated in the bow-shaped recesses from above so that lower portions of the photovoltaic devices are fitted into the through holes of the bowl-shaped recesses thereby to be thrust inside the plastic sealing material substantially by a predetermined amount, respectively, pouring a liquid phase of the transparent resin into the forming cavity of the forming die, hardening the liquid resin in the forming cavity of the forming die so that the photovoltaic devices are integrated by the transparent resin into a photovoltaic panel, and taking the photovoltaic panel out of the forming cavity of the forming die.

Method of fabricating photovoltaic panel

An apparatus for feeding a plurality of electric-component tapes each of which includes a carrier tape and holds a plurality of electric components in a lengthwise direction of the carrier tape, and supplying, from the each electric-component tape, the electric components, one by one, to an object device, the apparatus including a feeding device which feeds a first electric-component tape in a lengthwise direction thereof, and a connection-portion detecting device which detects a connection portion where a terminal end portion of the first electric-component tape being fed by the feeding device is connected to an initial end portion of a second electric-component tape.

Electric-component supplying apparatus and circuit-board assembling method for feeding a plurality of electric-component tapes

An object of the present invention is to provide an intensive machine performing a plurality of processes in a series of steps of fabricating a multilayer substrate. In order that the object may be achieved, the invention provides an intensive machine including an intensive platform installed in a direction in which a ceramic green sheet is fed out of a roll by a feeding apparatus. An adsorbing and conveying table is installed on the platform for conveying the sheet while the sheet is adsorbed and held by an air suction force. On the intensive platform are installed a via hole forming apparatus, via hole inspecting apparatus, filling and printing apparatus, filling and printing apparatus, filling and printing inspecting apparatus and wiring pattern printing apparatus arranged in the sheet conveying direction.

Intensive machine for performing a plurality of processes in fabrication of multilayer substrate

A system of mounting a plurality of electric components on a circuit substrate and thereby producing an electric circuit including a system for performing the following steps of taking, immediately before each of the electric components is mounted on the circuit substrate, a first image of a first portion of the circuit substrate on which the each electric component is to be mounted and a second portion of the circuit substrate that is adjacent to the first portion, mounting the each electric component on the circuit substrate, taking, immediately after the each electric component is mounted on the circuit substrate, a second image of the mounted electric component, and inspecting, by comparing the first and second images with each other, a state in which the each electric component is mounted on the circuit substrate.

System for mounting of electric components

A method of producing a photovoltaic panel, including the steps of producing a light-transmitting, photovoltaic-element holding member which holds, along a reference surface, a plurality of photovoltaic elements each of which includes a P-type layer and an N-type layer, and forming, on one of opposite sides of the photovoltaic-element holding member, a first electrode which is electrically connected to the respective P-type layers of the photovoltaic elements, and a second electrode which is electrically connected to the respective N-type layers of the photovoltaic elements.

Photovoltaic panel and method of producing same

An apparatus for displacing two displaceable members, including a first member, a second member which is supported by the first member such that the second member is displaceable relative to the first member, a third member which is supported by the second member such that the third member is displaceable relative to the second member, a first and a second drive source which have respective output members and each of which is not movable relative to the first member, a mechanically motion-transmitting device which is connected to the respective output members of the first and second drive sources and to the second and third members and which mechanically transmits respective motions of the output members to the second and third members while allowing the second and third members to be displaced relative to each other, and a displacement control device which is connected to the first and second drive sources and which controls the first and second drive sources and thereby controls the displacement of each of the second and third members relative to the first member.

Moving apparatus and displacing apparatus

A method of connecting respective one end portions of two carrier tapes to each other, each of the two tapes having accommodating pockets at a first pitch and tape-feed holes at a second pitch, each of the accommodating pockets accommodating an electric component, the method including aligning a tape connecting member which includes a flat main portion having tape-feed holes at a third pitch equal to the second pitch, and caulking projections projecting perpendicularly from the flat main portion, with the respective one end portions of the two tapes, such that tape-feed holes of the connecting member are aligned with respective tape-feed holes of the two tapes, causing at least two caulking projections of the connecting member to penetrate through the respective thickness of the two tapes, so that the flat main portion of the connecting member contacts a respective major surface of the two tapes, and caulking respective portions of the two caulking projections that penetrate out of the respective other surfaces of the two tapes, so that the respective one end portions of the two tapes are connected to each other.

Tape connecting method, member and tool

A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.

Circuit-component mounting method and circuit-component mounting system

A chuck apparatus including a chuck, and a power-driven device which selectively places the chuck in an object-hold state thereof in which the chuck holds an object, and an object-release state thereof in which the chuck releases the object, the power-driven device including, as a power source thereof, an electric motor.

Chuck apparatus

A method of supplying circuit components to a component mounting device from a feeder. The component mounting device removes the components from the feeder and transfers them to and mounts them on a circuit substrate. The method includes providing a plurality of feeders which each include a main portion, a feeding mechanism, a component supply portion and a component holding portion. The component holding portions hold the circuit components. The main portions of the feeders are mounted on a movable table such that the component holding portions of the feeders are arranged along a line. The main portions support the feeding mechanisms, which feed the circuit components one by one from the component holding portions to component supply portions. The movable table is moved along the line. The movable table is intermittently stopped so that the component-supply portions of each of the feeders are sequentially positioned at a component supply position, at which each feeder supplies at least one circuit component from its component supply portion. When the movable table and the feeder main portions are accelerated and decelerated, the component holding portions and the components held thereby accelerate and decelerate at a lower rate.

Method of supplying circuit components using a feeder

An electric-component transferring apparatus including a component holder which holds an electric component, a shaft member whose lower end portion supports the component holder, a movable member having a support hole which supports the shaft member such that the shaft member is rotatable about an axis line relative to the movable member and is movable relative to the movable member in an axial direction parallel to the axis line, a moving device which moves the movable member in a direction intersecting the axis line of the shaft member, a piston which is supported by the shaft member such that the piston is not movable relative to the shaft member in the axial direction of the shaft member, the support hole including a portion defining a cylinder bore which cooperates with the piston to provide an air-pressure-operated cylinder device, a driven wheel which is substantially integral with the shaft member, and a drive wheel which is supported by the movable member such that the drive wheel is meshed with the driven wheel to rotate the driven wheel, one of the drive wheel and the driven wheel having a length which assures that the drive and driven wheels are kept meshed with each other when the driven wheel is moved with the shaft member in the axial direction thereof.

Electric-component transferring apparatus, method of taking images of electric components, and electric-component mounting system

Producing a photovoltaic panel, including forming holes in a first electrode plate, fitting, in the holes, photovoltaic elements, each having a P-N junction between a core and a shell, electrically connecting a first portion of the shell of each photovoltaic element to the first electrode plate, removing one second portion of the shell of each photovoltaic element located on both sides of the first portion of the shell, so that a third portion of the core of the each photovoltaic element that corresponds to the one second portion of the shell is exposed, and electrically connecting the third portion of the core of each photovoltaic element to a second electrode plate, wherein electrically connecting the first portion and electrically connecting the third portion includes soldering, a corresponding one of the first portion and the third portion to a corresponding one of the first electrode plate and the second electrode plate.

A rotary-type circuit-component supplying apparatus including a plurality of feeders each of which stores a plurality of circuit components of a same sort and which supplies the components one by one from a component-supply portion thereof, at least one rotary table which is rotatable about a first axis line which is substantially vertical and which holds the feeders such that the respective component-supply portions of the feeders are arranged along a circle having a center on the first axis line, and a table-driving device which rotates and stops the rotary table to position the component-supply portion of each of the feeders at a predetermined component-supplying position, the feeders including at least one pendent feeder which includes a main portion which is held by the rotary table such that the main portion extends in a substantially horizontal direction, and which supports a tape-feeding mechanism which feeds a tape carrying the circuit components to the component-supply portion of the pendent feeder, and a reel-holding portion which is pendent from the main portion and which holds a reel around which the tape is wound, such that a whole of the reel is positioned below the main portion.

Rotary-type circuit-component supplying apparatus

A method supporting a printed circuit board, including the step of causing a contact portion of at least one board supporting member including a vibration damping portion formed of a vibration damping rubber, to contact at least one portion of a lower surface of the printed circuit board and thereby support the printed circuit board on a side of the lower surface thereof.

Method of supporting printed circuit board and method of mounting electric components

Growing community of inventors

Nagoya, Japan

Koichi Asai