Kabushiki Kaisha Toshiba

Kohsoku Nagata

Keizo Shimamura

Tatsuyoshi Aisaka

Kagetaka Amano

A dispersion strengthened copper alloy containing a copper matrix, and dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %. In this alloy, an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.

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Yokohama, Japan

Kohsoku Nagata