Sakai Display Products Corporation

Hon Hai Precision Industry Co., Ltd.

Sharp Kabushiki Kaisha Corporation

Kohichi Tanaka

Katsuhiko Kishimoto

Yozo Narutaki

Yukiya Nishioka

Kazunobu Mameno

Toshio Mizuki

Akihiko Kohno

According to a flexible light-emitting device production method of the present disclosure, after an intermediate region () and a flexible substrate region () of a plastic film () of a multilayer stack () are divided, the interface between the flexible substrate region () and a glass base () is irradiated with lift-off light. The multilayer stack () is separated into the first portion () and the second portion () while the multilayer stack () is kept in contact with the stage (). The first portion () includes a plurality of light-emitting devices () which are in contact with the stage (). The light-emitting devices () include a plurality of functional layer regions () and the flexible substrate region (). The second portion () includes the glass base () and the intermediate region (). The step of irradiating with the lift-off light includes forming the lift-off light from a plurality of arrayed light sources such that the irradiation intensity of the lift-off light for at least part of the interface between the intermediate region () and the glass base () is lower than the irradiation intensity of the lift-off light for the interface between the flexible substrate region () and the glass base ().

Lift-off method and apparatus for manufacturing flexible light emitting device

According to a flexible light-emitting device production method of the present disclosure, after an intermediate region () and flexible substrate regions () of a plastic film () of a multilayer stack () are divided from one another, the interface between the flexible substrate regions () and a glass base () is irradiated with lift-off light. The multilayer stack () is separated into a first portion () and a second portion () while the multilayer stack () is in contact with a stage (). The first portion () includes a plurality of light-emitting devices () which are in contact with the stage (). The light-emitting devices () include a plurality of functional layer regions () and the flexible substrate regions (). The second portion () includes the glass base () and the intermediate region ().

Method and apparatus for manufacturing flexible light emitting device

A method for producing an organic EL display device in an embodiment includes step (a) of forming a polymer film () on a support substrate (); step (b) of forming a plurality of organic EL display panel portions () on the polymer film (); and step (c) of causing the organic EL display panel portions () on a stage (S) to face the stage (S), and directing a line beam (L) in a direction from the support substrate () toward at least an interface between the polymer film () and the support substrate () while moving the line beam (L) and the support substrate () with respect to each other, the step (c) being performed in a state where the organic EL display panel portions () are substantially thermally insulated from the stage (S).

Method for manufacturing organic el display device

According to a flexible light-emitting device production method of the present disclosure, after an intermediate region () and flexible substrate regions () of a plastic film () of a multilayer stack () are divided from one another, the interface between the flexible substrate regions () and a glass base () is irradiated with lift-off light. The multilayer stack () is separated into a first portion () and a second portion () while the multilayer stack () is in contact with a stage (). The first portion () includes a plurality of light-emitting devices () which are in contact with the stage (). The light-emitting devices () include a plurality of functional layer regions () and the flexible substrate regions (). The second portion () includes the glass base () and the intermediate region (). The step of irradiating with the lift-off light includes the first light scanning for scanning the interface in a first direction with the light in the form of a line beam, and the second light scanning for scanning the interface in a second direction with the light. In each of the first and second light scanning, the irradiation intensity is modulated such that the intensity for at least part of the interface between the intermediate region () and the glass base () is lower than the irradiation intensity for the interface between the flexible substrate regions () and the glass base ().

Method and device for manufacturing flexible light emission device

According to a flexible OLED device production method of the present disclosure, after an intermediate region () and flexible substrate regions () of a plastic film () of a multilayer stack () are divided from one another, the interface between the flexible substrate regions () and a glass base () is irradiated with laser light. The multilayer stack () is separated into a first portion () and a second portion () while the multilayer stack () is in contact with a stage (). The first portion () includes a plurality of OLED devices () which are in contact with the stage (). The OLED devices () include a plurality of functional layer regions () and the flexible substrate regions (). The second portion () includes the glass base () and the intermediate region ().

Method and apparatus for producing flexible OLED device including lift-off light irradiation

According to a flexible light-emitting device production method of the present disclosure, after an intermediate region () and a flexible substrate region () of a plastic film () of a multilayer stack () are divided, the interface between the plastic film () and a glass base () is irradiated with lift-off light. The multilayer stack () is separated into the first portion () and the second portion () while the multilayer stack () is kept in contact with the stage (). The first portion () includes the intermediate region () and a light-emitting device () which are adhered to the stage (). The light-emitting device () includes a functional layer region () and the flexible substrate region (). The second portion () includes the glass base (). The intermediate region () adhered to the stage () is removed from the stage while the light-emitting device () is kept adhered to the stage.

Method and apparatus for manufacturing flexible light-emitting device

According to a flexible light-emitting device production method of the present disclosure, after an intermediate region and flexible substrate regions of a plastic film of a multilayer stack are divided from one another, the interface between the flexible substrate regions and a glass base is irradiated with lift-off light. The multilayer stack is separated into a first portion and a second portion while the multilayer stack is in contact with a stage. The first portion includes a plurality of light-emitting devices which are in contact with the stage. The light-emitting devices include a plurality of functional layer regions and the flexible substrate regions. The second portion includes the glass base and the intermediate region. The stage has ejection holes in a region which is to face the intermediate region, from which a fluid is ejected in the separation step.

According to a flexible light-emitting device production method of the present disclosure, after an intermediate region () and flexible substrate regions () of a plastic film () of a multilayer stack () are divided from one another, the interface between the flexible substrate regions () and a glass base () is irradiated with lift-off light. The multilayer stack () is separated into a first portion () and a second portion () while the multilayer stack () is in contact with a stage (). The first portion () includes a plurality of light-emitting devices () which are in contact with the stage (). The light-emitting devices () include a plurality of functional layer regions () and the flexible substrate regions (). The second portion () includes the glass base () and the intermediate region (). The step of irradiating with the lift-off light includes making the irradiation intensity of lift-off light for at least part of the interface between the intermediate region () and the glass base () lower than the irradiation intensity of lift-off light for the interface between the flexible substrate regions () and the glass base ().

In a flexible OLED device production method, after an intermediate region and flexible substrate region of a plastic film of a multilayer stack are divided, the interface between the flexible substrate region and glass base is irradiated with laser light. The multilayer stack is separated into first and second portions while the multilayer stack is kept in contact with the stage. The first portion includes a plurality of OLED devices in contact with the stage. The OLED devices include a plurality of functional layer regions and the flexible substrate region. The second portion includes the glass base and intermediate region. The laser light is formed from a plurality of arranged laser light sources and irradiation intensity for at least part of the interface between the intermediate region and the glass base is lower than the irradiation intensity for the interface between the flexible substrate region and the glass base.

Method and apparatus for producing flexible OLED device

A flexible display supporting substrate of the present disclosure includes: a glass base (); a plastic film () which has a surface (), the surface having a polish recess (), the plastic film being supported by the glass base (); and an oxide layer () overlying a part of the surface () of the plastic film () and covering at least part of the polish recess ().

Flexible display, method for manufacturing same, and support substrate for flexible display

According to a flexible OLED device production method of the present disclosure, after an intermediate region () and flexible substrate regions () of a plastic film () of a multilayer stack () are divided from one another, the interface between the flexible substrate regions () and a glass base () is irradiated with laser light. The multilayer stack () is separated into a first portion () and a second portion () while the multilayer stack () is in contact with a stage (). The first portion () includes a plurality of OLED devices () which are in contact with the stage (). The OLED devices () include a plurality of functional layer regions () and the flexible substrate regions (). The second portion () includes the glass base () and the intermediate region (). The stage () has ejection holes in a region which is to face the intermediate region (), from which a fluid is ejected in the separation step.

According to a flexible OLED device production method of the present disclosure, a multilayer stack () is provided which includes a glass base (), a functional layer region () including a TFT layer (A) and an OLED layer (B), and a synthetic resin film () provided between the glass base () and the functional layer region () and bound to the glass base (). In a dry gas atmosphere whose dew point is not more than &#x2212;50&#xb0; C., the multilayer stack () is separated into a first portion () and a second portion (), and a surface (s) of the synthetic resin film () is exposed to the dry gas atmosphere, the first portion () including the functional layer region () and the synthetic resin film (), the second portion () including the glass base (). The first portion () is transported from the dry gas atmosphere to a reduced-pressure atmosphere R, and a protection layer () is formed on the surface () of the synthetic resin film () in the reduced-pressure atmosphere R.

A resin film is released from a supporting substrate without using light irradiation, with ease, and without damaging the resin film or the like. Preparation for separating the supporting substrate on which the resin film is cohesively formed into a first part and a second part; and at least one of the first part and the second part is allowed or caused to move in a direction parallel to an one surface of the first part while the first part of the supporting substrate and at least an edge of the second part facing the first part being moved with respect to one another, while a close contact between the resin film and an one surface of the second part of the supporting substrate being maintained, such that the first part and the edge of the second part are separated along a perpendicular direction to the one surface of the first part.

Method for releasing resin film and method for manufacturing organic EL display device

A method for manufacturing flexible electronic devices is provided to enable to manufacture the flexible electronic devices without increasing a number of steps, enables to reuse a glass substrate, and reduces the possibility that the flexible electronic devices are damaged or corners of them are not bent even if the detached flexible electronic devices are brought into contact with each other. Electronic device structuresare formed on a resin film substrateformed on a glass substrate, and flexible electronic devices including the electronic device structuresformed on device formation areasare separated from the resin film substrateby irradiating first laser beamshaving a longer wavelength along a rectangular shape having rounded corners or chamfers at four corners to each the device formation areas, subsequently, an interface between the glass substrateand the resin film substrateis metamorphosed by irradiation of second laser beamshaving a shorter wavelength to entire surface of the resin film substratefrom a back side of the glass substrateso as to make the resin film substrateeasy to be peeled off from the glass substrate

Method for manufacturing flexible electronic device

A method for producing a device support base in an embodiment according to the present disclosure includes step A of providing a support base having a first surface and a second surface parallel to the first surface; step B of forming a laser beam in a first direction parallel to the first surface of the support base; and step C of translating or rotating the laser beam in a second direction parallel to the first surface of the support base and crossing the first direction to remove at least a part of protruding portions or contamination elements on the first surface of the support base.

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Osaka, Japan

Kohichi Tanaka