Hitachi-high-technologies Corporation

Hitachi, Ltd.

Kohei Yamaguchi

Kenji Obara

Takehiro Hirai

Kazuo Aoki

Masashi Sakamoto

Seiji Isogai

Toshifumi Honda

Masato Suzuki

Hiroshi Morita

Ryo Nakagaki

Shinji Fujita

Akira Nishimizu

Hirohito Okuda

Yasunori Ono

Akira Yamagishi

Kenichi Kawamura

Satoshi Ichimura

Fumihiko Fukunaga

Li Lu

Jun Nukaga

Naoma Ban

Naoya Miyamoto

Hiroshi Miyao

Hideki Ogata

A stationary induction electrical apparatus includes a disc winding having a structure in which a flow path for a cooling medium is provided between coils where a low voltage is generated between shield wires, an L-shaped insulation barrier is provided between coils where a high voltage is generated between the shield wires, a horizontal portion of the L-shaped insulation barrier is provided so as to closely contact an upper surface or a lower surface of the disc coil, a tip end portion in an axial direction of the L-shaped insulation barrier is provided so as to closely contact an inner surface of the disc coil which is adjacent to a pressboard insulation cylinder, and a height of the tip end portion in the axial direction is lower than a thickness of one coil.

Stationary induction electrical apparatus

A stationary induction electric apparatus includes an iron core having legs of core and yokes of core; windings wound around the legs of core; coolant for cooling the windings; a cylindrical insulation structure that forms a flow of the coolant around the windings; baffle members alternately provided on the inner wall side and the outer wall side of the cylindrical insulation structure; and adjustment members for constricting the flow of the coolant. The adjustment members are provided on the same side of the respective baffle members and on the respective baffle members.

Stationary induction electric apparatus

For inspection of a pattern such as a semiconductor device, it is useful to selectively detect a defect on the specific pattern in order to estimate the cause of the occurrence of the defect. An object of the invention is to provide a charged particle beam apparatus capable of setting, on the basis of the shape of the pattern on a sample, a region to be inspected. The invention is characterized in that the contour of the pattern on the sample is extracted using a template image obtained on the basis of an image of the sample, the region to be inspected is set on the basis of the contour of the pattern, a defect candidate is detected by comparing the image to be inspected with a comparative image, and the sample is inspected using a positional relationship between the region to be inspected and the defect candidate included in the region to be inspected.

Charged particle beam apparatus

In a pattern inspection of a semiconductor circuit, to specify a cause of a process defect, not only a distribution on and across wafer of the number of defects but also more detailed, that is, the fact that how many defects occurred where on the semiconductor pattern is needed to be specified in some cases. Accordingly, the present invention aims to provide an apparatus capable of easily specifying a cause of a process defect based upon a positional relationship of a distribution of defect occurrence frequency and a pattern. The apparatus includes: a charged particle beam optical system for detecting secondary charged particles by irradiating the charged particle beam to the sample; an image processing unit for, based upon a plurality of images to be inspected that are obtained by the secondary charged particles, obtaining an occurrence frequency of defect candidates for each of predetermined regions inside the detected image; and a display unit for displaying the distribution of the occurrence frequency of the defect candidates so that a positional relationship to the pattern is recognized.

A technique executes autofocus adjustment stably even when a plurality of patterns or foreign matter capable of being imaged only by a specific detector are included independently. Such an image as a concavo-convex image having a weak contrast can be picked up. The technique can automatically focus such an image even when it is difficult to find a focus position in the image. A scanning electron microscope includes a plurality of detectors for detecting secondary signals from a specimen when irradiated with an electron beam, and a calculation unit for combining the signals obtained from the detectors. At least two of the detectors are provided to be symmetric with respect to the electron beam. The focus of the electron beam is adjusted based on the signals of the detectors or on a signal corresponding to a combination of the signals.

Scanning electron microscope

An inspection method and an inspection tool are capable of detecting a defect on a specimen. More particularly, the examples relate to an inspection method and an inspection tool for easily setting an inspection condition to be used in a defect inspection of an inspected pattern such as a semiconductor wafer, a liquid crystal display, or a photomask.

Defect inspection tool and method of parameter tuning for defect inspection tool

A review apparatus for reviewing a specimen by moving the specimen to pre-calculated coordinate includes: a function to measure a deviation amount between the pre-calculated coordinates and coordinates of an actual position of the specimen; a function to optimize a coordinate correcting expression to minimize the measured deviation amount; and a function to determine that the deviation amounts have converged. When the deviation amounts have converged, the measurement for the coordinate-correcting-expression optimization is terminated, and a field of view necessary for the specimen to be within the field of view is set according to a convergence value of the calculated deviation amount.

Defect review apparatus and method of reviewing defects

A defect review method and a defect review device using an electron microscope, reduce the number of user processes necessary to set automatic focal adjustment of an electron beam to provide easier sample observation. The review method comprises the steps of: performing focal adjustment for a plurality of coordinate positions pre-registered on the coordinate on an object under observation; creating a criterion for focal adjustment based on a focal position at each of the plurality of coordinate positions; setting a focal probe range based on a deviation between the criterion and the focal position; and determining an automatic focal adjustment range for defect detection on the object under observation based on the set focal probe range.

Review method and review device

A method which, while displacing the field-of-view, allows the image in a target area to be acquired without degradations such as out-of-focus of the image. Plural pieces of images are acquired before and after a target area while displacing the field-of-view. Next, these images are grouped into groups each of which includes several pieces of images, and integrated images on each group basis are created. Moreover, a relational expression is calculated which holds between image displacement quantity calculated by comparing the integrated images with each other and the number of the photographed pieces of images. Furthermore, image displacement quantities between the acquired plural pieces of images are calculated from this relational expression. Finally, these images are corrected by the amounts of these displacement quantities, then being integrated. This process allows reconfiguration of the image in the target area.

Scanning microscope

A defect review apparatus for reviewing a specimen by moving the specimen to pre-calculated coordinate includes: a function to measure a deviation amount between the pre-calculated coordinates and coordinates of an actual position of the specimen; a function to optimize a coordinate correcting expression to minimize the measured deviation amount; and a function to determine that the deviation amounts have converged. When the deviation amounts have converged, the measurement for the coordinate-correcting-expression optimization is terminated, minimizing a reduction in throughput. field of view (FOV) necessary for the specimen to be within the FOV is set according to a convergence value of the calculated deviation amount.

There is provided an electron microscope which can clearly detect a microscopic unevenness in a sample. According to a scanning electron microscope, when luminance signals from one pair of backscattered electron detectors are given by L and R, and when a luminance signal from a scattered electron detector is given by S, an adjustment value Lc of L and an adjustment value Rc of R are calculated by using primary homogeneous expressions of L, R, and S.

Imaging method

In a scanning electron microscope having the function of observing an attentional object on a specimen, an error in an in-focus position can be corrected at high speeds. When moving the field of view to an object to be observed on a specimen on which an electron beam is scanned, an error between an in-focus position indicated by a mechanism for measuring a height of surface of the specimen and an actual in-focus position is corrected on the basis of information concerning points which are among a plurality of measured points and are adjacent to the target observing point.

This SEM has a capability of preventing shift of a view field of the foreign matters at a stage where no sufficient correction is carried out when obtaining the SEM coordinate values used for transforming the coordinate values of the foreign matters on the sample sent from another device into the SEM coordinate values. The SEM selects the foreign matters closer to the center of the sample at first and then the foreign matters spirally from the center of the sample to the outer periphery.

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Hitachinaka, Japan

Kohei Yamaguchi