Ngk Insulators, Inc.

Kohei Yamada

Takayuki Inoue

Makoto Hamazaki

A honeycomb structure according to at least one embodiment of the present invention includes: partition walls defining cells each extending from a first end surface of the honeycomb structure to a second end surface thereof to form a fluid flow path; and an outer peripheral wall. The partition walls and the outer peripheral wall are each formed of ceramics containing silicon carbide and silicon. A surface of the silicon has formed thereon an oxide film having a thickness of from 0.1 μm to 5.0 μm.

Honeycomb structure and electric heating support using the honeycomb structure

A ceramic honeycomb structure includes: an outer peripheral wall; and a partition wall disposed on an inner side of the outer peripheral wall, the partition wall defining a plurality of cells, each of the plurality of cells to form a fluid flow path extending from one end face to other end face. The honeycomb structure contains: 1) particles including one or more selected from silicon carbide, silicon nitride and aluminum nitride; and 2) silicon doped with a dopant. The dopant is a Group 13 element or a Group 15 element. The honeycomb structure has a silicon content (B) of from 20 to 80% by mass, and the honeycomb structure has a porosity of 30% or less.

Honeycomb structure and electrically heating support

A honeycomb structure includes: an outer peripheral wall; and partition walls disposed on an inner side of the outer peripheral wall, the partition walls defining a plurality of cells, each of the plurality of cells extending from one end face to the other end face to form a flow path for a fluid. The partition walls and the outer peripheral wall include ceramics containing at least silicon. A content of silicon in the ceramics is 30% by mass or more. A concentration of at least one dopant in the silicon is from 10to 5&#xd7;10/cm.

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Nagoya, Japan

Kohei Yamada