Sumitomo Chemical Company, Limited

Kohei Ueda

Yasutoyo Kawashima

Yoshinobu Nozue

Yu Miura

Koji Ishiwata

A resin composition contains a polymer whose enthalpy of fusion (&#x394;H) observed within a temperature range of 10&#xb0; C. or higher and lower than 60&#xb0; C. in differential scanning calorimetry is 30 J/g or more; and a low-molecular-weight compound whose enthalpy of fusion (&#x394;H) observed within a temperature range of 0&#xb0; C. or higher and lower than 100&#xb0; C. in differential scanning calorimetry is 30 J/g or more and whose molecular weight is 2000 or lower. A content of the low-molecular-weight compound is 3 parts by weight to 1000 parts by weight with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition except the low-molecular-weight compound.

Resin composition and use thereof

Provided is a resin composition from which a heat dissipation sheet having high effect to suppress temperature elevation due to heat generated by electronic parts (elements) can be obtained. Specifically provided is a resin composition containing: a polymer (1) whose enthalpy of fusion observed within a temperature range of 10&#xb0; C. or higher and lower than 60&#xb0; C. in differential scanning calorimetry is 30 J/g or more; and a thermally conductive material (3) whose thermal conductivity is 1 W/(m&#xb7;K) or higher, wherein the content of the thermally conductive material (3) is 1 part by weight or more and 80 parts by weight or less, with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition.

A polymer that is capable of affording a heat storage material superior in humidity permeability and shape retention after phase transition and that is superior in molding processability is provided. The polymer includes constitutional units (A) derived from ethylene, constitutional units (B) represented by a specified formula, and optionally includes constitutional units (C) represented by another specified formula. Where the total number of the units (A), the units (B), and the units (C) is 100%, the number of the units (A) accounts for 70% to 99%, the total number of the units (B) and the units (C) accounts for 1% by weight to 30% by weight. Where the total number of the units (B) and the units (C) is 100%, the number of the units (B) accounts for 1% to 100% and the number of the units (C) accounts for 0% to 99%.

Growing community of inventors

Ichihara, Japan

Kohei Ueda