The Furukawa Electric Co., Ltd.

Kohei Terada

Takahiro Okada

Toshio Kimura

Takeshi Aikiyo

Takashi Koseki

Narihito Matsumoto

Takeshi Nagao

A semiconductor laser module is packaged on a mounting substrate through a thermal diffusion sheet member. The thermal diffusion sheet member is that having thermal conductivity where thermal conductivity in the surface direction is greater than that in the thickness direction. Specifically, the thermal diffusion sheet member is graphite, for example, and has a thermal conductivity of 300 W/m&middot;K or greater in the surface direction.

Mounting structure for semiconductor laser module

A laser diode module has a laser diode, a lens for condensing the laser beam from the laser diode, an optical fiber for receiving the laser beam from the lens at the end face thereof, and support assembly for supporting the laser diode, the lens, and optical fiber, the support assembly positions the end face of the optical fiber at a deviation position apart from the focal point of the lens by an allowable distance when a temperature of the laser diode module is room temperature and moves the end face of the optical fiber at a close position relatively closer to the focal point than the deviation position when the temperature of the laser diode module rises from the room temperature.

Laser diode module

Growing community of inventors

Tokyo, Japan

Kohei Terada