Fujitsu Component Limited

Tdk Corporation

Subaru Corporation

Preferred Networks, Inc.

Kohei Takahashi

Masahiro Kaneko

Nobuo Yatsu

Katsuaki Koshimura

Masataro Saito

Hokuto Eda

Miki Kitahara

Chuqi Liang

Masazumi Arata

Yayoi Tokuhara

Takamasa Iwasaki

Takuya Uchiyama

Ying Li

Hitoshi Ohkubo

Kenei Onuma

Manabu Ohta

Takahiro Kawahara

Yuuya Kaname

Ryo Fukuoka

Natsumi Sakai

Kiwa Imai

Koichi Kiryu

Manabu Shimizu

Hongfei Zhang

Iwao Murata

Hideki Soejima

Kousaburou Akiba

Hiroya Kaneko

Keiji Hori

Tsutomu Tomizawa

Takuya Yamauchi

In a coil component, a non-magnetic part is bridged between a first coil and a second coil in a cross section of an element body. Therefore, a magnetic flux in a direction along a magnetic core of the first coil and a magnetic core of the second coil is hindered by the non-magnetic part between the first coil and the second coil. Accordingly, a magnetic flux of the first coil and a magnetic flux of the second coil are difficult to interfere with each other.

Coil component

In the coil component, external stress applied when the upper coil structure, the lower coil structure, and the magnetic sheet are stacked is dispersed by the undulation of both main surfaces of the magnetic sheet. By dispersing the stress in this manner, a situation in which defects such as cracks occur in the coil structure is effectively suppressed.

By overlapping the protruding portion of the first insulator and the protruding portion of the second insulator via the protruding portion of the substrate, the DC superposition characteristic of the coil component is improved.

In an insulation layer of a coil component, a thickness of a second covering part and a third covering part located on the penetration hole side of a first covering part is thinner than that of the first covering part. A stray capacitance occurring between a flat coil pattern and external terminal electrodes is reduced by making the first covering part of the insulation layer thicker than the second covering part and the third covering part. Further, since the second covering part and the third covering part of the insulation layers are thinner than the first covering part, a magnetic volume is increased while external dimensions of the base body is maintained, and thus a high inductance is realized.

In a coil component, a main body portion is made of a metal magnetic powder-containing resin, and thus a resin component appears on end surfaces of the main body portion. In addition, since external terminal electrodes are made of a conductive resin, a resin component also appears on the surfaces of the external terminal electrodes. Accordingly, insulating coating layers are integrally covered with high adhesion with the end surfaces of the main body portion and the external terminal electrodes by the insulating coating layers coming into contact with the end surfaces of the main body portion so as to straddle the external terminal electrodes.

Electronic component

In a coil component, a first planar coil and a second planar coil are wound around a common magnetic core and are magnetically coupled to each other. However, the first planar coil and the second planar coil are not electrically connected to each other and form coil structures which are separate from each other. Thus, as compared with a case in which the first planar coil and the second planar coil form one coil structure, the first planar coil and the second planar coil are less likely to affect each other's characteristics.

In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Electronic component and coil component

In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.

A touch panel includes first arrays of electrodes, second arrays of electrodes, and an output part where leads extending from triangular end electrodes of the first arrays and the second arrays are connected to an external device. At least one corner electrode of the end electrodes which is located in a corner on one of four sides of the detection part where the output part is located has an area that is less than an area of other end electrodes.

Projective capacitive touch panel with suppressed capacitance coupling in corners

According to one implementation, a method of producing an ultrasonic inspection system includes creating design information on the ultrasonic inspection system and assembling the ultrasonic inspection system based on the design information. The design information includes numbers, positions and directions of at least one ultrasonic sensor and at least one ultrasonic transducer. The design information is created by an optimization calculation of which at least one parameter includes at least one of the numbers, positions and directions of the at least one ultrasonic sensor and the at least one ultrasonic transducer. The optimization calculation includes a simulation of an ultrasonic inspection for detecting a defect by the ultrasonic inspection system having the at least one ultrasonic sensor and the at least one ultrasonic transducer. The simulation is performed using a model simulating an object of the ultrasonic inspection.

Method of producing ultrasonic inspection system

A fluid level detection apparatus includes a vibrator, a vibration sensor, and a controller. The vibrator is configured to apply a vibration to a container that contains a fluid. The vibration sensor is configured to detect a vibration wave that is generated by the vibrator and propagates through the container. The controller is configured to control an operation of the vibrator and perform arithmetic processing on a detection signal obtained from the vibration sensor. The vibrator and the vibration sensor are provided on an outer wall surface of the container at respective positions that interpose, from above and below, a fluid level of the fluid provided in the container. The controller is configured to calculate a height of the fluid level, on the basis of the vibration wave detected by the vibration sensor.

Fluid level detection apparatus, fluid level detection method, and computer-readable medium containing fluid level detection program

One aspect of the present disclosure relates to an arithmetic processor including a detection unit that detects instruction information, wherein an instruction including a processing instruction to be performed after completion of DMA (Direct Memory Access) in a DMA request instruction is described in the instruction information and a data processing unit that uses data transferred by the DMA request instruction to execute an operation corresponding to the processing instruction based on the instruction information detected by the detection unit.

Growing community of inventors

Tokyo, Japan

Kohei Takahashi