Fuji Corporation

Kohei Sugihara

Koji Kawaguchi

Hidenori Goto

Mitsuru Sanji

Yoji Fujita

Ryohei Kamio

Takeshi Fujishiro

Junichi Narita

Kota Niwa

Naoya Iwata

A mounting device includes a control device. The control device images an imaging range which includes an illuminant of a light emitting component and acquires a light emitting component image when mounting the light emitting component which includes the illuminant onto a board. Next, the control device detects coordinates (illuminant detected center coordinates) of a center of the illuminant based on the light emitting component image. The control device performs the mounting of the light emitting component such that the light emitting component is held, the light emitting component moves over the board, and a center of the illuminant is positioned at predetermined coordinates on the board based on the illuminant detected center coordinates, without using information relating to an outer shape of the light emitting component which is based on the light emitting component image.

Mounting device

A component mounting device includes a control device configured to execute a recognition data creation process and a pickup process. In the recognition data creation process, the control device creates the recognition data by obtaining the angle information of the component, causing the imaging device to operate so as to image the component, and rotating the captured image so obtained to the reference angle based on the angle information. In the pickup process, the control device causes the head to operate so as to pick up the component after the supply state of the component is determined based on the captured image obtained by causing the imaging device to operate so as to image the component, the recognition data created in the recognition data creation process, and the angle information.

Component mounting device

A component mounting device is capable of mounting a component having a feature portion on an upper surface, on a board. The component mounting device picks up a component by a pickup member and loads the picked-up component on a temporary loading stand at an angle substantially equal to a target mounting angle to the board. Subsequently, the component mounting device images the upper surface of the loaded component by an upper imaging device and picks up again the loaded component. Then, the component mounting device mounts the component picked up again at the target mounting angle at the target mounting position corrected based on the positional deviation amount of the feature portion recognized by the upper surface image of the imaged upper surface.

Component-mounting device

A component mounter provided with a first raising and lowering device to raise and lower a raising and lowering member, and a second raising and lowering device to relatively raise a suction nozzle with respect to the raising and lowering member. The component mounter performs, among multiple types of operations of lowering the suction nozzle, a cleaning operation of cleaning the suction nozzle and a discarding operation of discarding a component for which an error occurred via a first operation mode of lowering the suction nozzle by driving the first raising and lowering device. Also, the component mounter performs pickup operation of picking up the component and mounting operation of mounting the component via a second operation mode of lowering the suction nozzle by driving the first raising and lowering device and the second raising and lowering device.

Component mounter

A mounter capable of curtailing interference between a mounting head that has a component holding section, and an exchange-use component holding section and a storage section that holds the exchange-use component holding section. A controller of the mounter reads head identification information for identifying the mounting head from the mounting head. Also, different quantities of protruding sections are formed on nozzle tray in accordance with the height in the Z-axis direction. Also, pressure switches that are pressed by protruding sections so as to turn on and off are provided on loading plate on which nozzle tray is loaded. By this, the controller is able to determine whether interference will occur between the mounting head and nozzle tray based on the detection signal of the pressure switches before the mounting head is moved.

Mounter

A mounting device in which a loading distance separating adjacent characteristic components are lined up side by side is shorter than separation distance between suction nozzle and mark camera, processing to image characteristic component by mark camera and recognize the position of characteristic component is performed consecutively or in one batch. With the mounting device, because mounting head is moved a loading distance that is shorter than the separation distance between suction nozzle and mark camera and image processing is performed consecutively or in one batch, the movement distance of mounting head is shorter.

Mounting device and mounting method

A load measuring device is provided with load sensor, data logger, and measurement start switch on body. When switch section is pressed down by a suction nozzle, load sensor outputs detection voltage to data logger in accordance with the size of the pressing load. Data logger records detection voltage for a specified time only from the time it starts receiving high level start recording signal from measurement start switch. By this, data logger does not record detection voltage until high level start recording signal is received from measurement start switch, thus does not incorrectly record vibrations and the like during conveyance as the load.

Load measuring device and load measuring method

A component mounting apparatus is provided with a controller that controls a mounting head. The mounting head is provided with a nozzle holder, a nozzle that is elastically supported to be movable up and down with respect to the nozzle holder, a flange that is provided at a position that is offset from the central axis of the nozzle, and a second engaging section that is able to move the nozzle downward by engaging with the flange and pressing down the flange against the elastic force of a nozzle spring. The controller measures in advance the deviation amount of the tip position of the nozzle between before and after the second engaging section moves the nozzle downward and controls the mounting head so as to suck the component and mount the component on the board taking the deviation amount into account.

Component mounting apparatus

A board work device includes a housing device, a holding device, a moving device, a first lane and a second lane, a corresponding relationship acquisition device, a priority order acquisition device, and a control device. The holding device exchangeably holds a board work tool that performs a board work on a board. The corresponding relationship acquisition device acquires a corresponding relationship between the types of the board work tool and each of the multiple board works for each of the boards. The control device controls the holding device and the moving device such that, when performing the board work based on the acquired corresponding relationship, in a predetermined case, the board work that is capable of being performed in the other lane is performed without exchanging the board work tool currently being held.

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Nishio, Japan

Kohei Sugihara