Sumitomo Electric Industries, Limited

Other

Nissan Chemical Industries Limited

Kohei Shimoda

Issei Okada

Masatoshi Majima

Masahiro Yamakawa

Akira Yamakawa

Takashi Kasuga

Kouji Yamaguchi

Youichi Nagai

Masaya Miyake

Tetsuya Kuwabara

Hiromichi Yanagihara

Shinichi Maeda

Kazuhiko Shiratani

Go Ono

Keiji Koyama

Toshiyasu Tsubouchi

Zenichiro Kato

Satoru Itsuaki

Kouiti Sogabe

Douiti Sogabe

Kazutoshi Shibutani

The present invention provides a metal coating formed by baking after applying a metal-nanoparticles-dispersed liquid onto a surface of a base material, the metal-nanoparticles-dispersed liquid being composed of metal nanoparticles, water, and a dispersant having a molecular weight of 2000-30000 and having a solid form at room temperature, wherein the metal coating comprises an alloy including (1) Ag and (2) at least one kind of metal selected from the group consisting of Au, Pt, Pd, Ru, Ir, Sn, Cu, Ni, Fe, Co, Ti and In, the content ratio of Ag being 80-99.9% by atomic percent in the total quantity of the alloy, and wherein the metal coating has an average grain size of 0.2-5 &#x3bc;m. The metal coating has small surface roughness, and superior smoothness and denseness, and has excellent properties for etching and adhesion to a base material. Also, the invention provides a method of forming such metal coating as well as a metal wiring formed by pattern formation of the metal coating.

Metal coating, forming method thereof, and metal wiring

An object of the present invention is to provide a method for manufacturing an electronic circuit component such as an organic TFT, which can manufacture an electronic circuit component excellent in reliability and having quality on a practical level, because an insulating layer and a conductive layer which have more excellent characteristics can be formed, particularly, on a general-purpose plastic substrate or the like by treatment at a process temperature of 200&#xb0; C. or lower which has no influence on the above-mentioned plastic substrate. The method for manufacturing an electronic circuit component according to the invention includes heating a layer containing at least one of a polyimide and a precursor thereof at a temperature of 200&#xb0; C. or lower to form an insulating layerhaving a contact angle with water of 80&#xb0; or more, forming a coating film including a dispersion containing metal nanoparticles on the above-mentioned insulating layerand heating the above-mentioned coating film at a temperature of 200&#xb0; C. or lower to form a conductive layer such as a source layeror a drain layer

Method for manufacturing electronic circuit component

A conductive paste mainly composed of a metal powder, a glass frit, and an organic vehicle. The total content amount of the metal powder and glass frit with respect to the entire conductive paste is 85 wt % or more. The viscosity at a rotational speed of 1 rpm measured at 25&#xb0; C. with an E type rotating viscometer is 100 Pa&#xb7;s or more and 400 Pa&#xb7;s or less.

Conductive paste and wiring board using it

The present invention relates to a metal catalyst containing fine metal particles, characterized in that the fine metal particles have a particle diameter of 3 nm or less and also have a proportion of metallic bond state of 40% or more, which is ascribed by subjecting to waveform separation of a binding energy peak peculiar to the metal as measured by using an X-ray photoelectron spectrometer. The fine metal particles are preferably fine platinum particles. The fine metal particles are preferably supported on the surface of carrier particles by reducing ions of metal to be deposited through the action of a reducing agent in a reaction system of a liquid phase containing the carrier particles dispersed therein, thereby to deposit the metal on the surface of carrier particles in the form of fine particles. The proportion of metallic bond state of the fine metal particles is adjusted within the above range by reducing after deposition thereby to decrease the oxidation state.

Metal catalyst and method for production thereof

When fine metal particles of a nanometer size are handled in a state of colloidal particles, it is difficult to handle them and the range of the selection of the solvent to be used is limited. The invention offers a granular metal powder that is produced by the steps of (a) preparing a suspension liquid comprising (a1) water, an organic solvent, or a mixture thereof, (a2) metal particles having an average particle diameter of at least 1 nm and at most 100 nm, and (a3) an organic compound capable of being adsorbed on the surface of the metal particles and (b) removing the water, organic solvent, or mixture thereof by drying the suspension liquid and that has an apparent density of at least 1.0 g/ml and at most 5.0 g/ml. The granular metal powder can be handled as a dry metal powder and is readily redispersed in a solvent.

Granular metal powder

A metallic colloidal solution (a) includes a water-based dispersion medium that is easy in handling with regard to safety and environment and metallic particles having a uniform particle diameter and being excellent in properties such as conductivity and (b) has properties suitable for various printing methods and ink-applying methods. In addition, an inkjet-use metallic ink incorporating the metallic colloidal solution has properties suitable for the inkjet printing method. The metallic particles are deposited by reducing metallic ions in water and have a primary-particle diameter of at most 200 nm. The dispersion medium is made of a mixed solvent of water and a water-soluble organic solvent. The metallic particles are dispersed in the dispersion medium under the presence of a dispersant having a molecular weight of 200 to 30,000.

Metallic colloidal solution and inkjet-use metallic ink

Provided is a conductive paste which can have high conductivity even if the sintering temperature is 500&#xb0; C. or less, and which does not cause an interference pattern or crack on a substrate even if a thick film thereof is formed on the substrate. The conductive paste comprises main components including a metal powder, a glass frit, and an organic vehicle. The metal powder is composed of spherical particles (A) having an average primary-particle diameter of 0.1 to 1 &#x3bc;m and spherical particles (B) having an average primary-particle diameter of 50 nm or less, and the content of spherical particles (A) ranges from 50 to 99 wt % and the content of spherical particles (B) ranges from 1 to 50 wt %. The content of the glass frit ranges from 0.1 wt % to 15 wt % to the total amount of the glass frit and the metal powder. Preferably, the glass frit does not contain lead and has a working point of 500&#xb0; C. or less, and the average particle diameter thereof is 2 &#x3bc;m or less. The present invention can widely be applied to print on a substrate and sinter so as to form an electric circuit on the substrate.

Electrically conductive pastes

A method of producing metal powder by reducing ions of a metal for precipitation by performance of a reducing agent in a liquid-phase reaction system, wherein the metal is precipitated as metal powder particles by being reduced under conditions in which the exchange-current density of an oxidation-reduction reaction between the metal ions and the reducing agent is 100 &#x3bc;A/cmor less, the exchange-current density being determined by the mixed potential theory.

Method of producing metal powder

A method of manufacturing the chain-structure metal powder comprises precipitating a metal powder by a reaction performed in an aqueous solution in which nickel ions, complex ions, and titanium ions containing trivalent titanium ions (Ti3+) and tetravalent titanium ions (Ti4+) are present.

Method of manufacturing chain-structure metal powder

A conductive silver paste according to the present invention comprises epoxy resin, flake-shaped silver powders having an average particle diameter of 0.5 to 50 &#x3bc;m, and spherical silver powders, each having its surface coated with organic matter, having an average particle diameter of not more than 1 &#x3bc;m, and a conductive film according to the present invention is formed by printing or applying the conductive silver paste on a surface of a base material, followed by drying, and then thermosetting the epoxy resin.

Conductive silver paste and conductive film formed using the same

A particulate filter can be prevented from being damaged. The ashes can be removed from the particulate filter without by burning. A non-woven welding operation for a sealing portion can be simplified. The operability is enhanced by facilitating an insertion of a multi-layer body into a heat resisting container. The number of recycling processes executed when particulate matters such as soot are accumulated on the particulate filter is made as small as possible. A particulate filter comprises an axial core composed of a heat resisting metal, a multi-layer body formed by winding said axial core with a multi-layer member into which a non-woven fabric and a corrugated sheet each composed of a heat resisting metal are tiered, and a heat resisting container charged with said multi-layer body

Particulate filter

The present invention provides a nonwoven metal fabric for various uses, such as a filter used for purification of exhaust gas from automobiles or semiconductor manufacturing gas, a catalyst carrier of fuel cell, and so forth, in which the corrosion resistance is improved without compromising the property in terms of pressure loss. The nonwoven metal fabric of the present invention is formed with the metal fibers wherein the relation of the fiber diameter Da at the surface part of the gas inlet side and the fiber diameter Db at the central part of the thickness direction is expressed as the equation Da&gE;1.5&times;Db and the fiber diameter Da at the surface part of the gas inlet side is not less than 15 &mgr;m and not more than 60 &mgr;m.

Nonwoven metal fabric and method of making same

An aluminum nitride sintered body characterized by comprising aluminum nitride as the main component, containing a titanium compound, and having a black color, a transmittance of 10% or less with the light having a wavelength in the range of from 500 to 650 nm and a heat conductivity of 120 W/m.multidot.K or more. The sintered body is produced by adding 0.05 to 5% by weight, in terms of Ti, of a titanium compound and a sintering aid compound and, if necessary, a compound capable of forming carbon after being thermally decomposed to an aluminum nitride powder, molding the mixture, heating the molding in vacuo, air or a nitrogen gas, a hydrogen gas or an atmosphere comprising a mixture of these gases until the residual carbon content is reduced to 2.0% by weight or less, and sintering the heat-treated mixture in a nonoxidizing atmosphere containing nitrogen at 1600.degree. C. or above. The titanium compound is Ti.sub.n O.sub.2n-1 or a solid solution comprising Ti.sub.n O.sub.2n-1 and nitrogen partly dissolved therein in the solid solution form wherein n is 1 or more, or a compound represented by the formula TiN.sub.x O.sub. y wherein 0&lt;x&lt;1 and y is 3/2 (1-x). There is provided an aluminum nitride sintered body wherein both the light shielding property and the heat conductivity are stabilized.

Growing community of inventors

Osaka, Japan

Kohei Shimoda