Tokyo Electron Limited

Kohei Otsuki

Akiyoshi Mitsumori

Yoshitomo Konta

Toru Fujii

Shin Yamaguchi

Koji Kamata

Daisuke Satake

A substrate processing apparatus is provided. The apparatus comprises a chamber; a substrate support which is arranged in the chamber and has at least one first gas supply path; and at least one control valve configured to control a flow rate or pressure of gas supplied through the at least one first gas supply path. The substrate support includes a base, and an electrostatic chuck which is arranged on the base and has an upper surface. The upper surface has a plurality of protrusions and a first annular groove group. The first annular groove group comprises a first inner annular groove, a first intermediate annular groove, and a first outer annular groove. Any one of the first inner annular groove, the first intermediate annular groove, and the first outer annular groove communicates with the at least one first gas supply path.

Substrate processing apparatus and electrostatic chuck

A plasma processing apparatus includes a processing vessel; a placing table, serving as a lower electrode, disposed within the processing vessel; an upper electrode serving as a facing electrode of the placing table; a plasma processor configured to form a gas within the processing vessel into plasma by supplying a high frequency power and to process a processing target object on the placing table with the plasma; a cover member configured to cover the upper electrode from thereabove; a cooler provided within the cover member and configured to cool the upper electrode with a coolant having a temperature lower than a dew point temperature of exterior air outside the processing vessel; and a gas supply configured to supply a low-dew point gas having a dew point temperature lower than the dew point temperature of the exterior air into a space surrounded by the cover member and the upper electrode.

Plasma processing apparatus and plasma processing method

Energy consumption of a temperature control unit can be reduced. A flexible pipeincludes a bellows pipemade of a metal and an inner tube. The inner tubeis provided at an inner side of the bellows pipe, and an inner surface of the inner tube where a fluid flows is smooth. The inner surface of the inner tubewhere the fluid flows may be smoother than a surface of a braided body. Further, the inner tubemay be made of, for example, a conductive material. An inner side of the inner tubewhere the fluid flows may be coated with a conductive film.

Flexible pipe and temperature control system

A processing systemincludes a heat insulating pipe, a temperature measuring device, and a control device. The heat insulating pipehas an inner pipe and an outer pipe. An airtight space is formed between the inner pipe and the outer pipe. A fluid having a temperature lower than that of an indoor space in which the heat insulating pipeis placed is flown within the inner pipe. The temperature measuring devicemeasures a temperature of a surface of the heat insulating pipe. The control deviceis controls a pressure within the airtight space by controlling an exhaust deviceconfigured to exhaust a gas within the airtight space based on the temperature of the surface of the heat insulating pipeand a dew-point temperature calculated from a humidity and the temperature of the indoor space.

Growing community of inventors

Miyagi, Japan

Kohei Otsuki