Mitsubishi Materials Corporation

Kohei Otogawa

Kiyotaka Nakaya

Kotaro Masuyama

Tomohiko Yamaguchi

Provided is a bonding sheet using a copper particle that is less prone to deteriorate the sintering property due to oxidation of the copper particle, and can form a dense bonding layer having fewer voids, and can also bond an electronic component and the like with a high bonding strength. A bonding sheet () contains a copper particle () and a solvent () having a boiling point of 150° C. or higher, in which the copper particle () has a surface covered with an organic protective film, the content ratio of the copper particle () to the solvent () is in the range of 99:1 to 90:10 by mass, and the BET diameter of the copper particle () is in the range of 50 nm to 300 nm both inclusive.

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Tokyo, Japan

Kohei Otogawa