Shin-etsu Chemical Co., Ltd.

Semileds Corporation

Kohei Otake

Nobuaki Matsumoto

Toshiyuki Ozai

Taichi Kitagawa

Yoshinori Ogawa

Shuhei Ueda

Keiji Ohori

Chen-Fu Chu

Kazunori Kondo

David Trung Doan

Yi-Feng Shih

Shih-Kai Chan

Atsushi Yaginuma

Tsuyoshi Matsuda

Trung Tri Doan

Hideo Nakagawa

Shoichi Osada

Mamoru Hagiwara

Norifumi Kawamura

Eri Asakura

A stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding component including a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component. This provides: a stamp component that can be fixed stably by a simple and convenient vacuum chuck system; a stamp head unit with which the stamp component can be replaced in a short time; and a microstructure-transfer apparatus provided with the stamp component and the stamp head unit.

Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component

Provided are an excellently convenient ultraviolet-curable organopolysiloxane causing no surface curing inhibition even when cured in the atmosphere; a composition containing such organopolysiloxane; and a cured product of such composition. The organopolysiloxane is represented by the following formula (1):

Organopolysiloxane, ultraviolet-curable silicone composition and cured product

Provided are a low-viscosity ultraviolet curable silicone composition capable of being used even in a surface exposure method and a lift-up method etc.; and a cured product superior in tensile strength and elongation at break. The ultraviolet curable silicone composition contains:

Ultraviolet curable silicone composition and cured product thereof

(A) an organopolysiloxane having, per molecule, two groups each represented by formula (1) (Rrepresents a Cmonovalent hydrocarbon group, Rrepresents an oxygen atom or the like, Rrepresents an acryloyloxyalkyl group or the like, and p and a respectively represent numbers satisfying 0-10 and 1-3); (R, R, R, a, and p are identical to those described above), a RSiOunit (b) (in the formula, Rrepresents a monovalent hydrocarbon group having 1-10 carbon atoms), and a SiOunit (c), and in which the mole ratio of the total of units (a) and (b) to unit (c) is in a range of 0.4 to 1.2:1; and

Ultraviolet ray curable silicone adhesive composition and cured product thereof

A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate

Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate

According to the present invention, an ultraviolet curable silicone composition for stereolithography, which contains (A) an organopolysiloxane that has two groups represented by formula (1) (wherein each Rindependently represents a monovalent hydrocarbon group having 1-20 carbon atoms; Rrepresents an oxygen atom or the like; Rrepresents an acryloyloxyalkyl group or the like; p represents a number satisfying 0&#x2264;p&#x2264;10; and a represents a number satisfying 1&#x2264;a&#x2264;3) in each molecule,(B) an organopolysiloxane resin that is composed of (a) a unit represented by formula (2) (wherein R-R, a and p are as defined above), (b) an RSiOunit (wherein each Rindependently represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (c) an SiOunit, and wherein the molar ratio of the total of the unit (a) and the unit (b) to the unit (c) is within the range of 0.6-1.2:1 and(C) a photopolymerization initiator has a viscosity that is applicable to a stereolithography system such as lifting system and forms a cured product which has excellent physical properties of rubber.

Ultraviolet curable silicone composition for stereolithography and cured product of same

This composition contains (A) 100 parts of an organopolysiloxane having two groups represented by general formula (1)  (Rrepresents a monovalent hydrocarbon group having 1-20 carbon atoms, Rrepresents an oxygen atom or the like, Rrepresents an acryloyloxyalkyl group or the like, p represents a number satisfying 0&#x2264;p&#x2264;10, and 'a' represents a number satisfying 1&#x2264;a&#x2264;3) per molecule, (B) 1-500 parts of a monofunctional (meth)acrylate compound not containing a siloxane structure, (C) 1-5,000 parts of an organopolysiloxane resin containing (a) an RSiOunit (in the formula, Rrepresents a monovalent hydrocarbon group having 1-10 carbon atoms) and (b) a SiOunit, where the molar ratio of the unit (a) to the unit (b) is in the range of 0.6 to 1.2:1, (D) 1-100 parts of fine powder silica, and (E) 0.01-20 parts of an optical polymerization initiator. The compound has good shape retention properties and curability for irradiation with ultraviolet light, and provides a cured product which has excellent adhesion suitable for a temporary fixing material.

UV curable silicone adhesive composition and cured product thereof

An ultraviolet-curable pressure-sensitive silicone adhesive composition which comprises: 100 parts of an organopolysiloxane (A) having, in the molecule, two groups represented by general formula (1) (wherein Rrepresents a Cmonovalent hydrocarbon group, Rrepresents an oxygen atom, etc., Rrepresents an acryloyloxyalkyl group, etc., p and a respectively indicate numbers satisfying 0&#x2264;p&#x2264;10 and 1&#x2264;a&#x2264;3); 1-500 parts of a monofunctional (meth)acrylate compound (B) containing no siloxane structure and/or a polyfunctional (meth)acrylate compound (C) containing no siloxane structure; 1-5,000 parts of an oranopolysiloxane resin (D) comprising RSiOunits (a) (wherein Rrepresents a Cmonovalent hydrocarbon group) and SiOunits (b), the (a)/(b) molar ratio being (0.6-1.2)/1; and 0.01-20 parts of a photopolymerization initiator (E). This composition has satisfactory applicability and curability and gives a cured object which, when used as a temporary fixer, has excellent tackiness and strength.

Ultraviolet-curable pressure-sensitive silicone adhesive composition and cured object obtained therefrom

The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.

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Annaka, Japan

Kohei Otake