Mitsubishi Denki Kabushiki Kaisha

Sysmex Corporation

Kohei Murakami

Junji Fujino

Ryuichiro Ebi

Osamu Hayashi

Masaharu Moriyasu

Shozui Takeno

Yoshiyuki Morihiro

Akira Adachi

Mitsuhiro Nonogaki

Emi Kanemura

Mari Yoshimura

Disclosed is a cell analyzer comprising: a measuring device that includes a collecting section configured to collect target cells in a specimen with a filter, and is configured to measure the target cells collected by the collecting section; and a data processing device configured to analyze the target cells based on measurement data obtained by the measuring device, wherein the cell analyzer is operable in a first mode of measuring a clinical specimen collected from a subject and a second mode of measuring a quality control specimen containing particles having size capturable by the filter; and the data processing device is programmed to acquire an amount of particles collected by the collecting section based on measurement data of the quality control specimen obtained in the second mode, and output an alarm when the amount of particles meets a predetermined condition.

Cell analyzer, cell collecting apparatus, and quality control method including processing and analyzing quality control particles

Flux for soldering comprising inorganic ion-exchanger and activator containing halogen atom, solder composition the flux and solder particles, soldering method comprising coating the solder composition on a portion for soldering, soldering method comprising coating flux containing activator on a portion for soldering, applying inorganic ion-exchanger to the portion and applying solder to the portion, and soldering method comprising mixing inorganic ion-exchanger with creamy solder to give mixture, coating the mixture on a circuit pattern of a wiring plate and heating the wiring plate. The flux for soldering and the soldering composition are excellent in metal ion-migration resistance, corrosion resistance, soldering property and storage stability, and can be preferably used without cleaning and the soldering methods can be preferably used in practical no-clean soldering methods.

Flux for soldering and solder composition comprising the same and

A process is provided for working a base material which essentially consists of a ceramic material. The process includes an irradiation process of irradiating a laser beam or an electron beam to the base material in order to form an affected portion having cracks in the base material and a removing process for removing the affected portion. The ceramic material includes an oxide ceramic material (for example, alumina and forsterite) and a carbide ceramic material. The shape and the depth of the portion to be worked are controlled by the scanning of the laser beam or the electron beam. The removing process can include any one of the processes of vibrating the base material, applying a thermal shock to the base material and etching the base material. In accordance with the present invention, a base material which essentially consists of an oxide ceramic material or a carbide ceramic material can be worked with high aspect ratio and in a shorter period of time than in a conventional process.

Method for working ceramic material

Growing community of inventors

Hyogo, Japan

Kohei Murakami