Mitsubishi Heavy Industries Limited

Kohei Kanaoka

Takashi Ishide

Saneyuki Goya

Toshiya Watanabe

Yoshihito Fujita

Makoto Yamasaki

Tsugumaru Yamashita

Ryu Suzuki

Minoru Danno

Masato Kinouchi

A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation headand a control device. The irradiation headincludes a laser turning unitand a condensing optical system. The laser turning unitincludes a first prism, a second prism, a first rotating mechanism, and a second rotating mechanism. The control device adjusts the differences between rotation speeds and phase angles of the first prismand the second prismbased on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.

Processing apparatus and processing method

Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head () and a controller; and the irradiation head () can be divided into a collimate optical system, a laser revolving unit (), and a light collection optical system (). The laser revolving unit () has a first prism (), a second prism (), a first rotation mechanism (), and a second rotation mechanism (). The controller controls the rotational speeds and the difference in phase angles of the first prism () and the second prism (), on the basis of at least the relationship between a heat affected layer of a member to be machined and the revolving speed of the laser.

Machining device and machining method

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Tokyo, Japan

Kohei Kanaoka