Soc Corporation

Koh Ishimura

Hiroo Arikawa

Seiji Norisue

Akihiko Kanehara

Yoshitake Ohga

Manabu Furusawa

Fuse

A miniature fuse of surface mount type having a stable pre-arcing time-current characteristic and a strong time lag characteristic The fuse is easy to produce, and provides a constant pre-arcing time. The main body of the fuse is of rectangular ceramic construction of split type. A fusible member ( ) wound around a ceramic rod ( ) and is rested on a recessed portion ( ) of the lower ceramic casing ( ). The end portion ( ) of the fusible member ( ) is engaged with the side surface of the casing. The upper ceramic casing ( ) is laid on the lower casing, so that the caps ( ) are fit onto the opposite ends of the main body. The end portion ( ) of the fusible member ( ) and the cap ( ) are connected by welding. At the time of welding, projections ( ) to be fit in the recessed portions ( ) provided at the main body, is formed at the cap ( ), so that the cap ( ) can be fixed to the main body.

Miniature fuse of surface-mount type

A microchip fuse is disclosed which includes a casing constructed from box-like upper and lower members. On the end surfaces of both members, electrode sections are provided which are formed by plating metal onto a sintered conductive paste on the end surfaces. Grooves are provided on the members and filled with insulating material. A fusible element extends through the insulating material and the inner surface as formed when the both members are jointed together. The end portions of the fusible element are soldered to the electrode sections. A hollow portion is provided in the casing adjacent to the inner space by way of a thin wall to dampen the pressure of a gas generated during the interruption process.

Microchip fuse with a casing constructed from upper and lower members

A micro-chip fuse and a method of manufacturing the fuse is disclosed which includes a fusible element made of a metallic film that is formed by a depositioning process. Through-bores are provided through a first substrate and filled with a photosensitive resist to make smooth the surface of the first substrate. After curing the resist, metal is deposited on the surface of the first substrate to form a metallic film. A photosensitive resist is applied to the metallic film and a photomask is placed on the resist to effect an exposure and a development. The metallic film is etched and the resists are removed to form the fusible elements made of the metallic film extending over the through-bores. A second substrate is placed under the first substrate, and a third substrate including recesses for cover the through-bores is placed on the first substrate to laminate them. Electrodes are provided on the ends of the substrates. The laminated substrates are divided into individual micro-chip fuses.

Growing community of inventors

Kanagawa-ken, Japan

Koh Ishimura