Infineon Technologies Ag

Koh Hoo Goh

Bun-Hin Keong

Chee Chian Lim

Abdul Rahman Mohamed

Yoke Chin Goh

May Ting Hng

An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).

Electronic component and method for its production

A semiconductor package () comprises a semiconductor die () with a plurality of contact areas () on its active surface and an electrically conductive bump () on each contact area (). The die () and electrically conductive bumps () are encapsulated in a plastic housing () so that the plastic housing () encapsulates at least sides of the die () and sides of the electrically conductive bumps ().

Chip-sized flip-chip semiconductor package and method for making the same

A leadframe comprises a die mounting area, a plurality of lead fingers and a metal deposit having a negative electrochemical potential with respect to a standard Hhalf cell. A semiconductor package comprises the leadframe and a semiconductor chip having a plurality of contact areas mounted to the die mounting area and electrically connected to the inner ends of the lead fingers of the leadframe by a plurality of bond wires. The semiconductor chip, the bond wires and inner portions of the lead fingers are encapsulated by a plastic housing.

Growing community of inventors

Muar Johor, Malaysia

Koh Hoo Goh