Kabushiki Kaisha Toshiba

Toshiba Infrastructure Systems & Solutions Corporation

Koh Hashimoto

Makoto Higaki

Makoto Sano

Keiju Yamada

Manabu Mukai

Koji Akita

Yukako Tsutsumi

Takayoshi Ito

Akihiko Happoya

Shuichi Obayashi

Hiroki Mori

Koji Ogura

Hiroshi Yoshida

Tetsu Shijo

Xu Zhu

Masaki Nakamoto

According to one embodiment, a radar device includes a transmission module including a transmission antenna and first integrated circuits, a reception module including a reception antenna and second integrated circuits, and a third integrated circuit. Each of the first integrated circuits includes first transmission circuits, first reception circuits, and a first signal generation circuit. Each of the second integrated circuits includes second transmission circuits, second reception circuits, and a second signal generation circuit. The third integrated circuit includes third transmission circuits, third reception circuits, and a third signal generation circuit.

Radar device and radar system

According to one embodiment, a transducer includes: a first conductive member; a substrate forming a first space with the first conductive member; a second conductive member opposed to the first conductive member via the substrate, and forming a second space with the substrate; first conductors electrically connecting the first conductive member with the second conductive member; a first transmission conductor in at least one of the first/the second spaces; and a second transmission conductor in at least one of the first space or the second space, and separated from the first transmission conductor, wherein the second conductive member includes a through hole through the second conductive member in a direction opposed to the first conductive member, and connecting to the second space, and an orthogonal projection of the through hole in the direction includes at least portion of each of the first/the second transmission conductor.

Transducer, antenna apparatus, wireless apparatus, and method for manufacturing transducer

According to one embodiment an antenna apparatus includes: a first conductor layer; a second conductor layer; a dielectric layer between the first and the second conductor layers; a plurality of first conductor vias corresponding to a first direction; a plurality of second conductor vias opposed to the first conductor vias corresponding to the first direction; and a plurality of first openings in the first direction in a region of the first conductor layer between the first and the second conductor vias. A plurality of third conductor vias are part of the plurality of first conductor vias and are arranged along the first openings. Positions of the third conductor vias in a second direction are different from positions of others of the first conductor vias in the second direction, the second direction is substantially orthogonal to the first direction and is substantially parallel to the first conductor layer.

Antenna apparatus and search apparatus

A method for producing a dual-polarized antenna includes providing first, second and third dielectric substrates with first and second main surfaces. The method includes patterning a conductive film on the first main surface of the first dielectric substrate to form a first ground conductor having an opening and a metal patch as a radiation element, the patch aligned to the opening in a lamination direction, patterning a conductive film on the first main surface of the second dielectric substrate to form a first feed probe configured to excite the metal patch, patterning a conductive film on the second main surface of the second dielectric substrate to form a second ground conductor having a slot generally parallel to the first feed probe, and patterning a conductive film on the second main surface of the third dielectric substrate to form a second feed probe generally perpendicular to the slot.

Dual-polarized antenna

According to an embodiment, a wireless apparatus includes an interposer including a conductive portion; a semiconductor chip mounted on a component mounting surface of the interposer; a sealing resin on the component mounting surface and sealing the semiconductor chip; a conductive layer covering a surface of the sealing resin and a side surface of the interposer and electrically connected to the conductive portion; a first slot-shaped aperture on a principal surface portion of the conductive layer facing the component mounting surface; a second slot-shaped aperture on a side surface portion of the conductive layer facing the side surface and continuing to the first aperture; and a slot-shaped aperture at the conductive portion and continuing to the second aperture. The first to third apertures function as an integrated slot antenna. A total length of the first aperture is longer than a total length of the third aperture.

Wireless apparatus

An antenna device according to an aspect of the present invention includes a plurality of radiation elements, an array antenna, a skin material, a core material and an antenna casing. The plurality of radiation elements transmit radio waves of a predetermined frequency. The array antenna has a radiation surface and a back surface opposite to the radiation surface. The plurality of radiation elements are disposed on the radiation surface. The skin material is disposed in a direction in which the skin material faces the radiation surface. The core material is disposed between the array antenna and the skin material, and has a plurality of through-holes. The antenna casing is disposed in a direction in which the antenna casing faces the back surface. A distance between centers of adjacent through-holes of the through-hole is equal to or less than one-half of a wavelength corresponding to the predetermined frequency.

Antenna device

A plane antenna device includes a multi-layered dielectric substrate having a plurality of dielectric layers; a first conductive plane on or in the multi-layered dielectric substrate; a second conductive plane on or in the multi-layered dielectric substrate, wherein at least first and second dielectric layers of the plurality of dielectric layers are disposed between the first and second conductive planes; a first signal line being between the at least first and second dielectric layers, the first signal line being between the first conductive plane and the second conductive plane; a first conductive via in the first dielectric layer, the first conductive via being distanced from the first signal line; and a second conductive via in the second dielectric layer, the second conductive via being distanced from the first signal line, the second conductive via being aligned to the first conductive via.

Planar antenna

The wireless module according to an aspect of the present invention includes a board, a wireless communication chip that at least transmits or receives a high-frequency signal, an insulator, a conductive film, a feed line, first to third conductor patterns, and first and second vias. The chip, the feed line, and the first and second patterns are located on a first wiring layer of the board. The third pattern is at a ground potential and is located on a second wiring layer of the board. The insulator encapsulates the chip. The film covers at least a part of a side surface of the insulator. The feed line electrically connects the chip and the film. The first and second patterns are in contact with the film. The first via connects the first pattern and the third pattern. The second via electrically connects the second pattern and the third pattern.

Wireless module, printed circuit board, and method

An antenna device according to an aspect of the present invention includes dielectric plates, a first to fourth vias, lines, a conductor plate, opening sections, and an antenna element for transmission. The first to fourth vias respectively pierce through the dielectric plates corresponding to the vias and transmit high-frequency signals. A high-frequency signal flowing in the first via is transmitted to the element via a line and an opening section. The line is provided on an upper surface of a dielectric plate and is connected to an upper end portion of the first via. The opening section is provided right above a part of the line. A high-frequency signal flowing in the second, the third, and the fourth vias is transmitted from another line. The line is provided on an upper surface of another dielectric plate and is connected to an upper end of the second via.

Antenna device and antenna apparatus

According to an embodiment, a wireless device includes an interposer, a semiconductor chip, electrodes, and a slot antenna. The interposer includes conductive layers disposed at least at a side of a component mounting surface and a side of a reverse surface opposite to the component mounting surface. The semiconductor chip is mounted on the component mounting surface and includes a built-in transceiving circuit. The electrodes are disposed in a conductive layer disposed at the side of the reverse surface of the interposer so as to be electrically connected to an outside of the wireless device. At least a portion of the slot antenna is disposed in at least one of the conductive layers of the interposer. A shortest distance between an end in a width direction of the slot antenna and the electrodes is smaller than a sum of a minimum line width and a minimum line space of the interposer.

Wireless device

According to one embodiment, a converter includes a first dielectric substrate; a second dielectric substrate provided above the first dielectric substrate through a first adhesive layer; a first signal line provided between the first dielectric substrate and the second dielectric substrate; a first via that penetrates the first dielectric substrate and is coupled to the first signal line on an upper side of the first via; and a first conductor plate provided at least one of below the first dielectric substrate and above the second dielectric substrate.

Converter and manufacturing method thereof

According to an embodiment, a wireless device includes an interposer, a semiconductor chip, and a non-conductor. The interposer comprises a plurality of conductor layers. The semiconductor chip is mounted on the interposer and comprising a built-in transceiver circuit. The non-conductor is placed on the interposer and seals the semiconductor chip. From among the plurality of conductor layers, a first conductor layer and a second conductor layer are symmetrically positioned with respect to center in a thickness direction of the interposer respectively have a first antenna conductor pattern and a second antenna conductor pattern. The first antenna conductor pattern and the second antenna conductor pattern respectively have a first opening and a second opening functioning as a slot antenna and have substantially equal area of a conductor portion. An orthogonal projection of the first opening onto the second conductor layer overlaps with the second opening.

An array antenna device according to an embodiment of the present invention includes an array antenna, a core layer, and a first adhesive layer. The array antenna has a first surface on which one or more radiating elements are disposed. The core layer is disposed facing the first surface. The first adhesive layer is present between the array antenna and the core layer and bonds the array antenna and the core layer to each other. The first adhesive layer includes one or more first openings and one or more radiating elements are disposed inside the first opening.

Growing community of inventors

Yokohama, Japan

Koh Hashimoto