Nec Corporation

Koetsu Tamura

Shinichi Hasegawa

Hajime Matsuzawa

Yuzo Shimada

In an electronic device structure, a high dam is formed on a circuit board so as to enclose input/output terminals of an electronic component mounted on the circuit board. The input/output terminals are projected from a body of the electronic component and connected to a printed circuit formed on the circuit board. The body is covered with a metal case.

Electronic device structure capable of preventing malfunction caused by electromagnetic wave coming from outside

An electronic circuit package assembly of the present invention and implemented by a TAB (Tape Automated Bonding) system includes a sheet formed of thermosetting resin. The sheet intervenes between a substrate and an organic insulating film carrying an LSI (Large Scale Integrated circuit) chip thereon. Solder is buried in the sheet beforehand. The assembly is heated to cause the solder to melt and connect wiring electrodes formed on the substrate and outer leads provided on the organic insulating film. The assembly has high reliability when compared with other connection methods using solder and effectively prevents migration of the tape carrier.

Electronic circuit package assembly with solder interconnection sheet

A plurality of indentations,, and,are formed in one major surface of a printed board,. A plurality of electrode pads,, and,are provided on the one major surface and the bottom of the indentations. A plurality of solder portions,, and,are formed on the respective electrode pads. A plurality of electronic components,, and,each having a plurality of terminals are connected to the electrode pads in the corresponding indentations by means of the solder portions.

Surface mount assembly for electronic components

An electronic-circuit assembly according to the present invention comprises a first substrate on the upper surface of which a plurality of electrodes are provided. A second substrate is placed on the first substrate. The second substrate comprises a plurality of through-holes on the positions opposing to the plurality of terminals on the first substrate, respectively. The plurality of terminals on the first substrate are connected to the plurality of through-holes on the second substrate via a plurality of connecting members, respectively. A plate is placed on the upper surface of the second substrate. A plurality of pins which are provided on the under surface of the plate are inserted into the plurality of through-holes on the second substrate, respectively.

Electronic-circuit assembly

An electronic device assembly includes a large-scale integrated circuit (LSI) chip mounted on a flexible substrate. The flexible substrate is connected to a second substrate via solder. The flexible substrate is also attached to the second substrate via a resin. When the assembly is manufactured, the solder is provided between the substrates. The resin fills an area between the substrates. The solder and the resin are heated simultaneously. The solder melts to electrically connect the substrates. The resin is set to mechanically couple the substrates.

Electronic device assembly and a manufacturing method of the same

Electronic assembly package including connecting member between first

An organic insulation film has inner leads electrically connecting a conductor thereof with an LSI chip. The inner leads are connected to pads on the periphery of the LSI chip. The connecting portions between the inner leads and the pads of the LSI chip are sealed by casting a plastic seal. The plastic seal extends over the back side of the organic insulative film. The projected portion of the plastic seal at the back side of the organic insulative film is covered with a moisture-proofing seal member to provide more inexpensive than transfer molding and highly reliable seal structure for a tape carrier package.

Growing community of inventors

Tokyo, Japan

Koetsu Tamura