Universal Instruments Corporation

Delaware Capital Formation, Inc.

Koenraad Alexander Gieskes

John E Danek

Michael D Snyder

Stanley W Janisiewicz

Peter Joseph Dionne

Charles Andrew Coots

Darrin Michael Weiss

Stanislaw Wladyslaw Janisiewicz

James W Tripp

Kevin James O'Reilly

Daniel Joseph Hibbard

Hermanna Elisabeth Gieskes

Joseph F Kolcun

Philip Michael Castoro

Joan Sorin Nicolescu

A clinch mechanism for assembling a printed circuit board with electronic components includes a drive shaft configured to move along a vertical axis, a stationary anvil configured to remain stationary during movement of the drive shaft, a cutter having a cutting tip, and a toggle configured to rotate about a toggle rotation axis that includes an involute gear shaped tooth configured to roll across an involute trapezoidal slot of the cutter in order to impart movement on the cutter relative to the stationary anvil. Movement of the drive shaft along the linear axis is configured to move the cutter relative to the stationary anvil, and to move the cutting tip across the stationary anvil to cut an electronic lead located between the cutting tip and the stationary anvil, and to rotate the toggle about the axis.

Clinch mechanism for assembling a printed circuit board with electronic components

Disclosed herein is a system that includes a placement head, the placement head including a spindle assembly, the spindle assembly including a spindle capable of receiving one of a plurality of nozzles for attachment. The system includes a nozzle changer, the nozzle changer including a revolver capable of holding a plurality of nozzles. A position of the nozzle changer is changeable in response to movement of the spindle assembly. Further disclosed is a method of receiving and attaching nozzles with a nozzle changer.

Nozzle changer, system, and related method

An assembly machine comprising a continuous circuitous track; a dispensing head system configured to at least partially assemble products, wherein the dispensing head system includes one or more dispensing heads movable around the continuous circuitous track; a product conveyance system extending between a first location of the continuous circuitous track and a second location of the continuous circuitous track and a placement module, the placement module including a first positioning system configured to move along a first axis that intersects with the product conveyance system, wherein the first positioning system is configured to receive a first of the products from the product conveyance system and move the first of the products from the product conveyance system to a first placement location; and a second positioning system configured to move along a second axis that intersects with the product conveyance system, wherein the second positioning system is configured to receive a second of the products from the product conveyance system and move the second of the products from the product conveyance system to a second placement location.

Printed circuit board transport

A slip track includes a continuous circuitous track. The continuous circuitous track includes a layered printed circuit board. The layered printed circuit board includes a top track layer configured to supply electric power to a device having a contact element sliding across the top track layer, the layered printed circuit board further having a lower layer connected to the top track layer, the lower layer configured to supply electric power to the top track layer. The layered printed circuit board is flexible and is bent around curves in the continuous circuitous track. A method of assembly using the slip track is further disclosed.

Method of assembly

Disclosed is a dispensing head that includes a first spindle configured for movement in a vertical direction, a first nozzle operatively attached to the spindle, a heater device removably attachable to the dispensing head. The heater device includes a heat source and an opening configured to receive the first nozzle. The heat source is configured to heat the first nozzle above an ambient temperature. An assembly system is further disclosed, along with a method of heating a nozzle.

Dispensing head having a nozzle heater device, system and method

Disclosed herein is a method that includes picking up a plate with a nozzle, the plate including at least one opening to allow air to flow therethrough. The method includes picking up a die with the nozzle such that the plate is located between the nozzle and the die. The method includes placing the die and the plate onto a device, substrate or another die such that the plate is located on top of the die. The method includes heating the device, substrate or another die and the die in a heat chamber while the plate remains on top of the die to permanently attach the die to the device, substrate or another die. Further disclosed herein is an assembly system configured to perform a method that utilizes the plate and die combination for attaching the die to a device, substrate or another die by heating.

3D TSV assembly method for mass reflow

An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.

Flexible assembly machine, system and method

A dispensing head is disclosed including a control system located in the dispensing head, an encoder read head located in the dispensing head, and a light-capture sensor located in the dispensing head configured to detect a light flash of a stationary camera when the light flash illuminates a component on the dispensing head or an element of the dispensing head. The control system is configured to determine a precise encoder position with the encoder read head at a moment of the light flash. The dispensing head is configured to at least partially assemble an unfinished product. An assembly machine having the dispensing head and a method of at least partially assembling an unfinished product with the dispensing head is further disclosed.

Disclosed herein is a dispensing head that includes a motor, an air pump operably connected to and powered by the motor, and a first spindle connected to the air pump. The air pump is configured to create airflow in the first spindle. Further disclosed is a method of creating airflow in a dispensing head, and an assembly machine system having a dispensing head.

Pick and place head with internal vaccum and air pressure supply, system and method

Disclosed herein is a household type sewing machine that includes a transmitter configured to connect to a local device such as a Wi-Fi device, and an image capture device configured to capture a video of a workpiece being sewn by the household type sewing machine. The transmitter is configured to send the video captured by the image capture device to the local device. Further disclosed is a method that includes capturing, by the image capture device, a video of a workpiece being sewn by the household type sewing machine and sending the video captured by the image capture device to a mobile device. A sewing system is further disclosed.

Sewing machine, system and method

Disclosed herein is a method for applying a fluid to a component during a placement cycle. The method includes providing a component placement machine including a housing having a frame attached thereto, the frame having a pick and place head. The method includes providing a fluid application station contiguous with the housing and adapted to apply fluid to the component, moving the housing to a pick location, picking the component from a supply of components using the pick and place head, moving the housing to a location, applying fluid to the picked component, and placing the picked component with the fluid applied onto the printed circuit board at the location. The fluid application step is accomplished during the moving step or placing step. The method may further include repeating the steps for another component where the fluid application step is accomplished during the repeated picking step of the additional component.

Method and apparatus for applying fluid during a placement cycle

Provided is a PCB assembly machine including a board handling system configured to transport a PCB through the PCB assembly machine, wherein the PCB assembly machine further includes a pick and place system configured to pick and place electrical components onto the PCB. The PCB assembly machine also includes a feeder system configured to supply the electrical components, wherein the board handling system mounts directly to the feeder system.

Printed circuit board assembly machine

The present invention features a method whereby each vacuum nozzle in a multi-spindle component placement machine is inspected placement cycle. This process also allows for updating calibration of the nozzle position as well as immediate feedback regarding the condition of the vacuum nozzle. A chipped orifice or otherwise damaged nozzle is detected using a vision system and comparing the currently acquired image of each nozzle with the image of an 'ideal' nozzle. Likewise, contamination such as adhesive on the nozzle is detected before that contamination can affect placement accuracy. Because of the nozzle inspection during the placement cycle, there is no slowdown of the placement machine cycle rate.

Growing community of inventors

Deposit, NY, United States of America

Koenraad Alexander Gieskes