Asml Netherlands B.v.

Koen Thuijs

Hermanus Adrianus Dillen

Johannes Catharinus Hubertus Mulkens

Wim Tjibbo Tel

Jochem Sebastiaan Wildenberg

Daan Maurits Slotboom

Mark John Maslow

Marc Jurian Kea

Peter David Engblom

Ralph Timotheus Huijgen

Willem Louis Van Mierlo

Ronald Van Ittersum

Ivo Liebregts

Niladri Sen

Ronaldus Johannes Gysbertus Goossens

Fan Feng

A method of determining a characteristic of one or more processes for manufacturing features on a substrate, the method including: obtaining image data of a plurality of features on a least part of at least one region on a substrate; using the image data to obtain measured data of one or more dimensions of each of at least some of the plurality of features; determining a statistical parameter that is dependent on the variation of the measured data of one or more dimensions of each of at least some of the plurality of features; determining a probability of defective manufacture of features in dependence on a determined number of defective features in the image data; and determining the characteristic of the one or more processes to have the probability of defective manufacture of features and the statistical parameter.

Method for characterizing a manufacturing process of semiconductor devices

A method and associated apparatuses for controlling a process of manufacturing semiconductor devices on a substrate. The method includes obtaining process data relating to the process and determining a correction for the process based on the process data and a first control objective associated with the devices on the substrate. A first probability of the first control objective being achievable is determined and the correction adjusted based on the probability and at least a second control objective having a second probability of being achievable compared to the first control objective.

Method for controlling a manufacturing process and associated apparatuses

A computer-implemented defect prediction method for a device manufacturing process involving processing a pattern onto a substrate. Non-correctable error is used to help predict locations where defects are likely to be present, allowing improvements in metrology throughput. In an embodiment, non-correctable error information relates to imaging error due to limitations on, for example, the lens hardware, imaging slit size, and/or other physical characteristics of the lithography system. In an embodiment, non-correctable error information relates to imaging error induced by lens heating effects.

System and method for inspecting a wafer

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Vught, Netherlands

Koen Thuijs