Ricoh Company, Ltd.

Yokogawa Electric Corporation

Koei Suzuki

Takanori Tano

Atsushi Onodera

Hidenori Tomono

Hiroshi Miura

Shunichi Sato

Naoto Jikutani

Takuro Sekiya

Satoru Sugawara

Takashi Takahashi

Akihiro Itoh

Akira Sakurai

Kazuya Miyagaki

Atsuyuki Watada

Ken Kanai

Yusuke Tsuda

Shinji Satoh

Masayoshi Katoh

Teruyuki Furuta

Shuuichi Hikichi

Takumi Yamaga

Yoshikazu Akiyama

Ikue Kawashima

Haruo Nakamura

Shunsuke Baba

A wiring board includes a variable wettability layer situated on a top surface of a support board and containing a material of which a critical surface tension changes by energy given thereto. A conductive layer is situated inside a concave portion formed in the variable wettability layer. The concave portion has opposite side walls formed in tapered surfaces inclining so that a distance between the side walls is reduced toward a bottom of the concave portion in a cross-sectional shape taken along a plane perpendicular to a conducting direction of the conductive layer. Upper edges of the side walls are formed in gently curved surfaces.

Wiring board and manufacturing method thereof

A method of forming a stacked-layer wiring includes forming first wettability variable layer on a substrate using material that changes surface energy by energy application; forming first conductive layer in or on the first wettability variable layer; forming second wettability variable layer on the first wettability variable layer using material that changes surface energy by energy application; forming concave portion to become wiring pattern of second conductive layer to the second wettability variable layer while concurrently forming high surface energy area on surface exposed by forming the concave portion by changing surface energy; forming via hole by exposing a part of the first conductive layer while concurrently forming high surface energy area on surface exposed by forming the via hole by changing surface energy; and applying conductive ink to the high surface energy area to form the second conductive layer and via simultaneously.

Method of forming stacked-layer wiring, stacked-layer wiring, and electronic element

A method of manufacturing an interconnection member includes forming on a substrate a wettability changing layer containing a material in which critical surface tension is changed by giving energy; forming a depression part in the wettability changing layer by a laser ablation method using a laser of an ultraviolet region; and coating the depression part with an electrically conductive ink to form an electrically conductive part. At the same time when a pattern of the depression part is formed in the wettability changing layer, a pattern of a high surface energy area is formed as a result of the critical surface tension being changed.

Method of manufacturing interconnection member and electronic device

A disclosed laminated structure includes a wettability-variable layer containing a wettability-variable material whose surface energy changes when energy is applied thereto and including at least a high-surface-energy area having high surface energy and a low-surface-energy area having low surface energy; and a conductive layer formed on the high-surface-energy area. The high-surface-energy area includes a first area and a second area extending from the first area and having a width smaller than that of the first area.

Laminated structure, multilayer circuit board, active matrix substrate, and electronic display

A multiple-layer wiring substrate having a first conductive layer; an interlayer insulating layer; and a second conductive layer is disclosed, wherein the interlayer insulating layer includes a material whose surface energy is changed by receiving energy, and has a first region which does not include a contact hole and a second region which is formed such that its surface energy is higher than that of the first region, wherein a region within the contact hole of the first conductive layer has surface energy which is higher than surface energy of the second region of the interlayer insulating layer, and wherein the second conductive layer is formed by laminating, wherein the second conductive layer is in contact with the second region of the interlayer insulating layer along the second region, and is connected to the first conductive layer via the contact hole.

Multi-layer wiring substrate, active matrix substrate, image display apparatus using the same, and multi-layer wiring substrate manufacturing method

A method for manufacturing a laminated structure includes a step of supplying a droplet of a functional fluid selectively to at least a first region of a high surface energy area formed in a wettability variable layer of the laminated structure. In the step, the droplet is supplied by inkjet printing, and a center position of the droplet is determined in such a manner as to satisfy both Equations (1) and (2) below:&#x3c;&#xb1;(22&#x3b1;)/2 (here,2+2&#x3b1;) &#x2003;&#x2003;(1)&#x3c;&#xb1;(&#x2212;2&#x3b1;)/2 (here,2+2&#x3b1;) &#x2003;&#x2003;(2),where X is a distance between a center position of the first region and the center position of the droplet, D is a diameter of the droplet when travelling, &#x3b1; is variation in a landing position of the droplet, L is width of the first region, and S is a gap between the first and the second regions.

Laminated structure, multilayer wiring board, active matrix substrate, image display apparatus, and method for manufacturing laminated structure

Disclosed is a laminated structure, including a substrate, a wettability changing layer on the substrate, the wettability changing layer including a material, a critical surface tension of the material being changed by providing energy thereto, and an electrically conductor layer on the substrate, the electrically conductor layer formed on a region of the wettability changing layer, the region being provided with the energy, wherein the material includes a structural unit including a side chain and a structural unit including no side chain.

Laminated structure, method of manufacturing a laminated structure, electronic element, electronic element array, image displaying medium, and image displaying device

In an unauthorized access information collection system for monitoring unauthorized access to a honeynet so as to collect unauthorized access information, the system includes: a plurality of honey pots in which a private address or a global address is respectively set and which construct the honeynet; and an unauthorized access information collection device which is disposed between an Internet and the honeynet and which allocates a plurality of global addresses to the private address or the global address by setting of a routing table to transfer a received packet and which performs a communication control from the honeynet side to the Internet side based on a communication control list and records the packets passing through the unauthorized access information collection device.

Unauthorized access information collection system

A laminated structure includes a wettability variable layer formed on a substrate, including a material whose critical surface tension varies by receiving energy so that high and low surface energy regions are formed; a conductive layer formed in one of the high surface energy regions; and an insulating layer formed in such a manner as to cover the conductive layer, wherein another one of the high surface energy regions is formed in such a manner as to surround a periphery of a circuit formation region in which a plurality of the conductive layers are formed; and the insulating layer is formed in such a manner as to also cover the another one of the high surface energy regions so that an adhesive guard ring region is formed between the wettability variable layer and the insulating layer.

Laminated structure and image display device

A laminate structure is disclosed that has a region having high surface free energy and a region having low surface free energy that are well separated, has high adhesiveness between an underlying layer and a conductive layer, and can be formed easily with low cost. The laminate structure includes a wettability-variable layer including a first surface free energy region of a first film thickness and a second surface free energy region of a second film thickness, and a conductive layer formed on the second surface free energy region of the wettability-variable layer. The second film thickness is less than the first film thickness and the surface free energy of the second surface free energy region is made higher than the surface free energy of the first surface free energy region by applying a predetermined amount of energy on the second surface free energy region.

Laminate structure, electronic device, and display device

A disclosed laminated structure includes a substrate; a wettability varying layer formed on the substrate, the wettability varying layer including a material whose critical surface tension is changed by receiving energy; and an electrode layer formed on the wettability varying layer, the electrode layer forming a pattern based on the wettability varying layer. The material whose critical surface tension is changed by receiving energy includes a polymer including a primary chain and a side chain, the side chain including a multi-branched structure.

Laminated structure, electronic element using the same, manufacturing method therefor, electronic element array, and display unit

A disclosed laminate structure is capable of having its surface free energy changed with a small amount of UV irradiation. The invention also discloses a method of manufacturing the laminate structure; an electronic device having the laminate structure; an electronic device array having a plurality of the electronic devices; and a display apparatus having the electronic device array. The laminate structure includes a substrate, a wettability variable layerdisposed on the substrate, and a conducting layerpatterned on the wettability variable layer. The wettability variable layerincludes a material whose critical surface tension varies upon application of energy. The material with variable critical surface tension has a main chain and a side chain. The side chain has two or more sites of which the bond is cleaved upon absorption of energy.

Laminate structure and its manufacturing method, including wettability variable layer of material of variable critical surface tension

Method for forming a laminated structure having a wettability-variable layer

A wiring pattern is disclosed including: a variable wettability layer including a material whose critical surface tension changes in response to energy provided thereto, the wettability changing layer including a high surface energy part exhibiting a high critical surface tension and a low surface energy part exhibiting low critical surface tension; and a conductive pattern layer formed on the variable wettability layer at the high surface energy part. The conductive pattern layer has an elongated shape with a chamfered corner part in a plan view.

Wiring pattern, electronic device, organic semiconductor device, layered wiring pattern, and layered wiring substrate using the wiring pattern

A surface-emission laser diode includes a distributed Bragg reflector tuned to wavelength of 1.1 &#x3bc;m or longer, wherein the distributed Bragg reflector includes an alternate repetition of a low-refractive index layer and a high-refractive index layer, with a heterospike buffer layer having an intermediate refractive index interposed therebetween with a thickness in the range of 5-50 nm.

Growing community of inventors

Kanagawa, Japan

Koei Suzuki