Cascade Microtech, Inc.

Formfactor Beaverton, Inc.

Formfactor, Inc.

Koby L Duckworth

Kenneth R Smith

K Reed Gleason

Eric W Strid

Mike Jolley

Peter Hanaway

Peter McCann

Gavin Neil Fisher

Eric Hill

Rodney Jones

Thomas Reiner Thaerigen

Kazuki Negishi

Joseph George Frankel

Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

Probe systems and methods

Probes with fiducial targets, probe systems including the same, and associated methods. The probes include a probe body, a probe beam, a probe tip configured to contact a device under test (DUT), and a fiducial target affixed to the probe beam. The fiducial target is configured to be visible to an optical system to determine a position of the probe tip relative to the DUT. The methods include methods of utilizing and/or manufacturing the probes.

Probes with fiducial targets, probe systems including the same, and associated methods

Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip.

Probe head assemblies, components thereof, test systems including the same, and methods of operating the same

Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.

Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same

Growing community of inventors

Newberg, OR, United States of America

Koby L Duckworth