Advanced Semiconductor Engineering, Inc.

Ko-Pu Wu

Chih-Hung Hsu

Yu-Shun Hsieh

Mei-Lin Hsieh

Yi-Cheng Hsu

Yuan-Chun Chen

Kuang-Hsiung Chen

Chin Li Huang

A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.

Lead frame, package structure and method for manufacturing the same

A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.

Device including a plurality of leads surrounding a die paddle and method for manufacturing the same

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Kaohsiung, Taiwan

Ko-Pu Wu